Performance and two-phase flow pattern for micro flat heat pipes

• Published in: International journal of heat and mass transfer Vol. 77; pp. 1115 - 1123
• Main Authors: Yang, Kai-Shing, Lin, Chen-Chuan, Shyu, Jin-Cherng, Tseng, Chih-Yung, Wang, Chi-Chuan
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 01.10.2014
• Subjects: Arrays; Chambers; Double layer; Flats; Heat pipe; Heat sources; Heat transfer; Silicon; Thermal resistance; Two-phase flow; Vapor chamber; Thermal resistance; Heat pipe; Vapor chamber; Two-phase flow
• ISSN: 0017-9310; 1879-2189
• DOI: 10.1016/j.ijheatmasstransfer.2014.06.056

In this study, thermal performance and flow visualization of a double layer flat micro vapor chamber are reported. Two micro vapor chambers having pin fin and pin fin array support structure are fabricated and tested. The micro vapor chambers are composed of silicon and glass wafers having an overall size of 35×40×1.525mm. Test results show that both the pin fin and pin fin array vapor chambers show an appreciably lower thermal resistance as compared to the solid silicon counterpart, the thermal resistance of the pin fin vapor chamber is about 52–60% of the solid silicon whereas the corresponding thermal resistance of pin fin array is only 17–20% of the solid silicon. The thermal resistance of the pin fin vapor chamber is moderately increased subject to the increase of supplied power whereas opposite trend is encountered for the pin fin array. The phenomenon is associated with the influence of dry-out phenomenon. It is found that the pin fin array vapor chamber is still in function even for an upside-down arrangement. The thermal resistance, however, is reduced with the rise of tilt angle, and the vertical arrangement gives the lowest thermal resistance. However, the thermal resistance is considerably increased if the heat source is placed upwards, and the corresponding thermal resistance for an upside-down heat source can be threefold higher than that of the vertical arrangement.