Effect of High-k Passivation Layer on High Voltage Properties of GaN Metal-Insulator-Semiconductor Devices

In this paper, the GaN-based MIS-HEMTs with Si 3 N 4 single-layer passivation, Al 2 O 3 /SiN x bilayer passivation, and ZrO 2 /SiN x bilayer passivation are demonstrated. High-k dielectrics are adopted as the passivation layer on MIS-HEMTs to suppress the shallow traps on the GaN surface. Besides, h...

Full description

Saved in:
Bibliographic Details
Published inIEEE access Vol. 8; pp. 95642 - 95649
Main Authors Cai, Yutao, Wang, Yang, Liang, Ye, Zhang, Yuanlei, Liu, Wen, Wen, Huiqing, Mitrovic, Ivona Z., Zhao, Cezhou
Format Journal Article
LanguageEnglish
Published Piscataway IEEE 2020
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:In this paper, the GaN-based MIS-HEMTs with Si 3 N 4 single-layer passivation, Al 2 O 3 /SiN x bilayer passivation, and ZrO 2 /SiN x bilayer passivation are demonstrated. High-k dielectrics are adopted as the passivation layer on MIS-HEMTs to suppress the shallow traps on the GaN surface. Besides, high permittivity dielectrics passivated MIS-HEMTs also show an improved breakdown voltage characteristic, and that is explained by 2-D simulation analysis. The fabricated devices with high-k dielectrics/SiN x bilayer passivation exhibit higher power properties than the devices with plasma enhanced chemical vapor deposition-SiN x single layer passivation, including smaller current collapse and higher breakdown voltage. The Al 2 O 3 /SiN x passivated MIS-HEMTs exhibit a breakdown voltage of 1092 V, and the dynamic R on is only 1.14 times the static R on after off-state V DS stress of 150 V. On the other hand, the ZrO 2 /SiN x passivated MIS-HEMTs exhibit a higher breakdown voltage of 1207 V, and the dynamic R on is 1.25 times the static R on after off-state V DS stress of 150 V.
ISSN:2169-3536
2169-3536
DOI:10.1109/ACCESS.2020.2995906