Reliability and Fatigue Analysis in Cantilever-Based MEMS Devices Operating in Harsh Environments

• Published in: Journal of Quality and Reliability Engineering Vol. 2014; pp. 1 - 16
• Main Authors: Tariq Jan, Mohammad, Hisham Bin Hamid, Nor, Md Khir, Mohd Haris, Ashraf, Khalid, Shoaib, Mohammad
• Format: Journal Article
• Language: English
• Published: New York Hindawi Publishing Corporation 2014; Hindawi Limited
• Subjects: Crack propagation; Design optimization; Devices; Electrostatic discharges; Fatigue (materials); Fatigue failure; Integrated circuits; Laboratories; Microelectromechanical systems; Microelectronics; Micromachining; Nanostructure; Paris; Semiconductors; Sensors
• ISSN: 2314-8055; 2314-8047
• DOI: 10.1155/2014/987847

The microelectromechanical system (MEMS) is one of the most diversified fields of microelectronics; it is rated to be the most promising technology of modern engineering. MEMS can sense, actuate, and integrate mechanical and electromechanical components of micro- and nano sizes on a single silicon substrate using microfabrication techniques. MEMS industry is at the verge of transforming the semiconductor world into MEMS universe, apart from other hindrances; the reliability of these devices is the focal point of recent research. Commercialization is highly dependent on the reliability of these devices. MEMS requires a high level of reliability. Several technological factors, operating conditions, and environmental effects influencing the performances of MEMS devices must be completely understood. This study reviews some of the major reliability issues and failure mechanisms. Specifically, the fatigue in MEMS is a major material reliability issue resulting in structural damage, crack growth, and lifetime measurements of MEMS devices in the light of statistical distribution and fatigue implementation of Paris' law for fatigue crack accumulation under the influence of undesirable operating and environmental conditions.