A study on the synthesis and formation behavior of nanostructured TiN films by copper doping

Ti–Cu–N nanocomposite films with varying copper content were deposited by simultaneous co-deposition of titanium nitride and copper using a reactive arc ion plating and magnetron sputtering hybrid system. The structure and mechanical properties of these films were found to be dependent on the copper...

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Bibliographic Details
Published inSurface & coatings technology Vol. 177; pp. 404 - 408
Main Authors Myung, Hyun S., Han, Jeon G., Boo, Jin H.
Format Journal Article
LanguageEnglish
Published Elsevier B.V 30.01.2004
Subjects
Copper doping
Nanostructured coating
Superhard coating
Ti–Cu–N
Nanostructured coating
Ti–Cu–N
Superhard coating
Copper doping
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Summary:Ti–Cu–N nanocomposite films with varying copper content were deposited by simultaneous co-deposition of titanium nitride and copper using a reactive arc ion plating and magnetron sputtering hybrid system. The structure and mechanical properties of these films were found to be dependent on the copper concentration. A maximum hardness of 42 GPa was exhibited by Ti–Cu–N film containing 1.5 at.% Cu. The role of a soft metallic phase in Ti–Cu–N nanostructured films containing one hard and one soft phase is also discussed.
Bibliography:SourceType-Scholarly Journals-2
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ISSN:0257-8972
1879-3347
DOI:10.1016/j.surfcoat.2003.09.016