Microstructural modifications and properties of SiC nanoparticles-reinforced Sn–3.0Ag–0.5Cu solder alloy
•SiC nanoparticles have been added into SAC305 solder.•SiC particles refined the microstructure and spacing between IMC particles.•SiC particles enhanced the elastic modulus, UTS and 0.2%YS of solder.•SiC particles slightly decreased the pasty range and increased the undercooling.•Correlations betwe...
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Published in | Materials in engineering Vol. 65; pp. 1196 - 1204 |
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Main Authors | , , , , |
Format | Journal Article |
Language | English |
Published |
Elsevier Ltd
01.01.2015
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Subjects | |
Online Access | Get full text |
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