Microstructural modifications and properties of SiC nanoparticles-reinforced Sn–3.0Ag–0.5Cu solder alloy

• Published in: Materials in engineering Vol. 65; pp. 1196 - 1204
• Main Authors: El-Daly, A.A., Desoky, W.M., Elmosalami, T.A., El-Shaarawy, M.G., Abdraboh, A.M.
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 01.01.2015
• Subjects: Elastic modulus; Lead-free solders; Mathematical models; Mechanical properties; Microstructure; Modulus of elasticity; Nanostructure; Particulate composites; Silicon carbide; Solders; Tin base alloys; Mechanical properties; Microstructure; Lead-free solders

•SiC nanoparticles have been added into SAC305 solder.•SiC particles refined the microstructure and spacing between IMC particles.•SiC particles enhanced the elastic modulus, UTS and 0.2%YS of solder.•SiC particles slightly decreased the pasty range and increased the undercooling.•Correlations betwe...