Microstructural modifications and properties of SiC nanoparticles-reinforced Sn–3.0Ag–0.5Cu solder alloy

• Published in: Materials in engineering Vol. 65; pp. 1196 - 1204
• Main Authors: El-Daly, A.A., Desoky, W.M., Elmosalami, T.A., El-Shaarawy, M.G., Abdraboh, A.M.
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 01.01.2015
• Subjects: Elastic modulus; Lead-free solders; Mathematical models; Mechanical properties; Microstructure; Modulus of elasticity; Nanostructure; Particulate composites; Silicon carbide; Solders; Tin base alloys; Mechanical properties; Microstructure; Lead-free solders
• ISSN: 0261-3069
• DOI: 10.1016/j.matdes.2014.08.058

•SiC nanoparticles have been added into SAC305 solder.•SiC particles refined the microstructure and spacing between IMC particles.•SiC particles enhanced the elastic modulus, UTS and 0.2%YS of solder.•SiC particles slightly decreased the pasty range and increased the undercooling.•Correlations between the experimental and theoretical data were analyzed. Nano-sized SiC particles-reinforced Sn–3.0Ag–0.5Cu (SAC305) composite solder was prepared by mechanically dispersing SiC particles into plain SAC305 alloy at 900°C for 90min. The effects of SiC addition on microstructure, melting behavior and tensile properties of as-cast SAC305 solders were systematically investigated. The data from microstructure-properties analysis of composite solder show that the nano-sized SiC particles has significantly refined the microstructure, increased the strength and elastic modulus in comparison with the plain SAC305 solder. In addition, SiC particles decrease the pasty range of composite SAC305-0.7SiC solder although the undercooling and eutectic temperature prolonged nearly at the SAC305 level. A strain rate-dependent model of elastic modulus (E), yield stress (0.2%YS) and ultimate tensile strength (UTS) was developed based on the test results. The predicted tensile parameters for both solders are reasonably close to the present experimental data.