Novel Maskless Bumping for 3D Integration

A novel, maskless, low‐volume bumping material, called solder bump maker, which is composed of a resin and low‐melting‐point solder powder, has been developed. The resin features no distinct chemical reactions preventing the rheological coalescence of the solder, a deoxidation of the oxide layer on...

Full description

Saved in:
Bibliographic Details
Published inETRI journal Vol. 32; no. 2; pp. 342 - 344
Main Authors Choi, Kwang‐Seong, Sung, Ki‐Jun, Lim, Byeong‐Ok, Bae, Hyun‐Cheol, Jung, Sunghae, Moon, Jong‐Tae, Eom, Yong‐Sung
Format Journal Article
LanguageEnglish
Published 한국전자통신연구원 01.04.2010
Subjects
low‐melting‐point solder
Maskless bumping
solder bump maker (SBM)
전자/정보통신공학
Online AccessGet full text

Cover

More Information
Summary:A novel, maskless, low‐volume bumping material, called solder bump maker, which is composed of a resin and low‐melting‐point solder powder, has been developed. The resin features no distinct chemical reactions preventing the rheological coalescence of the solder, a deoxidation of the oxide layer on the solder powder for wetting on the pad at the solder melting point, and no major weight loss caused by out‐gassing. With these characteristics, the solder was successfully wetted onto a metal pad and formed a uniform solder bump array with pitches of 120 µm and 150 µm.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
G704-001110.2010.32.2.004
ISSN:1225-6463
2233-7326
DOI:10.4218/etrij.10.0209.0396