A novel tactile sensor system for heavy-load applications based on an integrated capacitive pressure sensor

• Published in: Sensors and actuators. A. Physical. Vol. 68; no. 1; pp. 294 - 298
• Main Authors: Paschen, U., Leineweber, M., Amelung, J., Schmidt, M., Zimmer, G.
• Format: Journal Article Conference Proceeding
• Language: English
• Published: Lausanne Elsevier B.V 15.06.1998; Elsevier Science
• Subjects: Applied sciences; Electronics; Exact sciences and technology; General equipment and techniques; Heavy-load manipulation; Instruments, apparatus, components and techniques common to several branches of physics and astronomy; Integrated circuits; Mechanical instruments, equipment and techniques; Microelectromechanical systems; Microelectronics: LSI, VLSI, ULSI; integrated circuit fabrication technology; Micromechanical devices and systems; Physics; Pressure sensors; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Sensors (chemical, optical, electrical, movement, gas, etc.); remote sensing; Tactile sensors; Microelectromechanical systems; Pressure sensors; Heavy-load manipulation; Tactile sensors; Microelectronic fabrication; Heavy load; Manipulation; Micromachining; Experimental study; Electromechanical system
• ISSN: 0924-4247; 1873-3069
• DOI: 10.1016/S0924-4247(98)00021-1

We report on a tactile sensor system for heavy-load and heavy-duty applications. The sensor system is based on a surface-micromachined capacitive pressure sensor. A new packaging technique is presented that enables applications where large forces and rough operation environments prevail. Due to the CMOS compatibility, an efficient way to address and read out the sensor array can be realized. We present an application example that shows the enhanced versatility of heavy-load manipulators when using tactile sensors for manipulation tasks.