Effect of nano-particles on forced convection in sinusoidal-wall channel

• Published in: International communications in heat and mass transfer Vol. 37; no. 10; pp. 1520 - 1527
• Main Authors: Heidary, H., Kermani, M.J.
• Format: Journal Article
• Language: English
• Published: Kidlington Elsevier Ltd 01.12.2010; Elsevier
• Subjects: Channel; Channels; Computational fluid dynamics; Convection and heat transfer; Exact sciences and technology; Flows in ducts, channels, nozzles, and conduits; Fluid dynamics; Fluid flow; Forced convection; Fundamental areas of phenomenology (including applications); Heat transfer; Mathematical models; Nano-fluid; Nanocomposites; Nanomaterials; Nanostructure; Numerical study; Physics; Turbulent flows, convection, and heat transfer; Wavy; Forced convection; Wavy; Nano-fluid; Channel; Numerical study; Nanoparticles; Temperature distribution; Streamlines; Pipe flow; Nanofluid; Digital simulation; Modelling; Wavy wall; Finite volume methods; Heat transfer
• ISSN: 0735-1933; 1879-0178
• DOI: 10.1016/j.icheatmasstransfer.2010.08.018

In this paper heat transfer and flow field in a wavy channel with nano-fluid is numerically studied. The temperature of input fluid (T c) is taken less than that of the wavy horizontal walls (T w). The governing equations are numerically solved in the domain by the control volume approach based on the SIMPLE technique. Copper–water nano-fluid is considered for simulation. A wide spectrum of numerical simulations has been done over a range of Reynolds number, Re H, 5 ≤ Re H ≤ 1500, nano-fluid volume fraction, ϕ, 0 ≤ ϕ ≤ 20% and the wave amplitude, α, 0 ≤ α ≤ 0.3. The effects of these parameters are investigated on the local and average Nusselt numbers and the skin friction coefficient. Simulations show excellent agreement with the literature. From this study, it is concluded that heat transfer in channels can enhance by addition of nano-particles, and usage of wavy horizontal walls. These can enhance the heat transfer by 50%. The present work can provide helpful guidelines to the manufacturers of the compact heat exchangers.