Low-cost plastic sensor packaging using the open-window package concept

• Published in: Sensors and actuators. A, Physical Vol. 67; no. 1; pp. 185 - 190
• Main Authors: Cotofana, C., Bossche, A., Kaldenberg, P., Mollinger, J.
• Format: Journal Article Conference Proceeding
• Language: English
• Published: Lausanne Elsevier B.V 15.05.1998; Elsevier Science
• Subjects: Environmental effects on instruments (e.g., radiation and pollution effects); Environmental effects on instruments (eg, radiation and pollution effects); Exact sciences and technology; General equipment and techniques; Instruments, apparatus, components and techniques common to several branches of physics and astronomy; Open window package; Physics; Plastic packaging; Sensor packaging; Sensors (chemical, optical, electrical, movement, gas, etc.); remote sensing; Open window package; Sensor packaging; Plastic packaging; Packaging; Mould treatment; Sensors; Design for manufacture; Experimental study
• ISSN: 0924-4247; 1873-3069
• DOI: 10.1016/S0924-4247(97)01767-6

This paper presents a low-cost transfer mould packaging concept for sensors, based on a direct-mould principle. The advantage of this new packaging concept, which we call the open-window package, is that up to the moulding step the whole assembly process is compatible with the standard lead-frame processing. The open-window package concept allows plastic sensor packaging with one or more environmental access paths to be created in a single moulding step. As an application of this new packaging concept, a plastic sensor package with a single access path has been developed for commercial production. The performances of this new low-cost package are satisfactory and lifetime performances show promising results. Furthermore, packaging of other types of sensors is in preparation.