Property measurements on spray formed Si-Al alloys
A novel Si-Al alloy was prepared by spray forming process for electronic packaging. Property measurements on spray-formed Si-Al alloys after hot pressing were carried out. The results indicate that the alloys （Si-（30%-40%）Al） have advantageous physical and mechanical characteristics, including low c...
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| Published in | Transactions of Nonferrous Metals Society of China Vol. 17; no. 2; pp. 368 - 372 |
|---|---|
| Main Author | |
| Format | Journal Article |
| Language | English |
| Published |
Elsevier Ltd
01.04.2007
State Key Laboratory for Fabrication and Processing of Nonferrous Metals,Beijing General Research Institute for Non-ferrous Metals, Beijing 100088, China |
| Subjects | |
| Online Access | Get full text |
| ISSN | 1003-6326 |
| DOI | 10.1016/S1003-6326(07)60100-9 |
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| Abstract | A novel Si-Al alloy was prepared by spray forming process for electronic packaging. Property measurements on spray-formed Si-Al alloys after hot pressing were carried out. The results indicate that the alloys （Si-（30%-40%）Al） have advantageous physical and mechanical characteristics, including low coefficient of thermal expansion （6.9× 10^-6 - 8.7 ×10^-6/K）, high thermal conductivity （118-127 W/（m·K））, low density （2.421×10^3 - 2.465×10^3 kg/m^3）, high ultimate flexural strength （180-220 MPa） and Brinell hardness （162-261）. The alloys are easy to machine to tight tolerances using standard machine tools and they can be electroplated with gold finishes and soldered with Sn-Pb alloy without any difficulty. |
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| AbstractList | A novel Si-Al alloy was prepared by spray forming process for electronic packaging. Property measurements on spray-formed Si-Al alloys after hot pressing were carried out. The results indicate that the alloys (Si-(30%-40%)Al) have advantageous physical and mechanical characteristics, including low coefficient of thermal expansion (6.9X10-6-8.7X10-6/K), high thermal conductivity (118-127 W/(m-K)), low density (2.421X103-2.465X103 kg/m3), high ultimate flexural strength (180-220 MPa) and Brinell hardness (162-261). The alloys are easy to machine to tight tolerances using standard machine tools and they can be electroplated with gold finishes and soldered with Sn-Pb alloy without any difficulty. A novel Si-Al alloy was prepared by spray forming process for electronic packaging. Property measurements on spray-formed Si-Al alloys after hot pressing were carried out. The results indicate that the alloys （Si-（30%-40%）Al） have advantageous physical and mechanical characteristics, including low coefficient of thermal expansion （6.9× 10^-6 - 8.7 ×10^-6/K）, high thermal conductivity （118-127 W/（m·K））, low density （2.421×10^3 - 2.465×10^3 kg/m^3）, high ultimate flexural strength （180-220 MPa） and Brinell hardness （162-261）. The alloys are easy to machine to tight tolerances using standard machine tools and they can be electroplated with gold finishes and soldered with Sn-Pb alloy without any difficulty. A novel Si-Al alloy was prepared by spray forming process for electronic packaging. Property measurements on spray-formed Si-Al alloys after hot pressing were carried out. The results indicate that the alloys (Si-(30%–40%)Al) have advantageous physical and mechanical characteristics, including low coefficient of thermal expansion (6.9×10 −6–8.7×10 −6/K), high thermal conductivity (118–127 W/(m-K)), low density (2.421×10 3–2.465×10 3 kg/m 3), high ultimate flexural strength (180–220 MPa) and Brinell hardness (162–261). The alloys are easy to machine to tight tolerances using standard machine tools and they can be electroplated with gold finishes and soldered with Sn-Pb alloy without any difficulty. TG1; A novel Si-Al alloy was prepared by spray forming process for electronic packaging. Property measurements on spray-formed Si-Al alloys after hot pressing were carried out. The results indicate that the alloys (Si-(30%-40%)Al) have advantageous physical and mechanical characteristics, including low coefficient of thermal expansion (6.9×10-6-8.7×10-6/K), high thermal conductivity (118-127 W/(m·K)), low density (2.421×103-2.465×103 kg/m3), high ultimate flexural strength (180-220 MPa) and Brinell hardness (162-261). The alloys are easy to machine to tight tolerances using standard machine tools and they can be electroplated with gold finishes and soldered with Sn-Pb alloy without any difficulty. |
| Author | 魏衍广 熊柏青 张永安 刘红伟 王锋 朱宝宏 |
| AuthorAffiliation | State Key Laboratory for Fabrication and Processing of Nonferrous Metals,Beijing General Research Institute for Non-ferrous Metals, Beijing 100088, China |
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| Cites_doi | 10.1049/esej:19970502 10.1108/13565369810233104 |
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| Keywords | coefficient of thermal expansion Si-Al alloy electronic packaging material spray forming |
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| Snippet | A novel Si-Al alloy was prepared by spray forming process for electronic packaging. Property measurements on spray-formed Si-Al alloys after hot pressing were... TG1; A novel Si-Al alloy was prepared by spray forming process for electronic packaging. Property measurements on spray-formed Si-Al alloys after hot pressing... |
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| Title | Property measurements on spray formed Si-Al alloys |
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