Property measurements on spray formed Si-Al alloys

• Published in: Transactions of Nonferrous Metals Society of China Vol. 17; no. 2; pp. 368 - 372
• Main Author: 魏衍广 熊柏青 张永安 刘红伟 王锋 朱宝宏
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 01.04.2007; State Key Laboratory for Fabrication and Processing of Nonferrous Metals,Beijing General Research Institute for Non-ferrous Metals, Beijing 100088, China
• Subjects: coefficient of thermal expansion; electronic packaging material; Si-Al alloy; Si-Al合金; spray forming; 喷射成型; 热膨胀系数; coefficient of thermal expansion; Si-Al alloy; electronic packaging material; spray forming
• ISSN: 1003-6326
• DOI: 10.1016/S1003-6326(07)60100-9

A novel Si-Al alloy was prepared by spray forming process for electronic packaging. Property measurements on spray-formed Si-Al alloys after hot pressing were carried out. The results indicate that the alloys （Si-（30%-40%）Al） have advantageous physical and mechanical characteristics, including low coefficient of thermal expansion （6.9× 10^-6 - 8.7 ×10^-6/K）, high thermal conductivity （118-127 W/（m·K））, low density （2.421×10^3 - 2.465×10^3 kg/m^3）, high ultimate flexural strength （180-220 MPa） and Brinell hardness （162-261）. The alloys are easy to machine to tight tolerances using standard machine tools and they can be electroplated with gold finishes and soldered with Sn-Pb alloy without any difficulty.