3D printed electronics: Processes, materials and future trends

• Published in: Progress in materials science Vol. 127; p. 100945
• Main Authors: Tan, Hong Wei, Choong, Yu Ying Clarrisa, Kuo, Che Nan, Low, Hong Yee, Chua, Chee Kai
• Format: Journal Article
• Language: English
• Published: Oxford Elsevier Ltd 01.06.2022; Elsevier BV
• Subjects: 3D printed electronics; 3D printing; Additive manufacturing; Advanced functional materials; Electronic devices; Electronics; Functional materials; Inks; Materials science; Production methods; Three dimensional printing; Trends; Additive manufacturing; 3D printed electronics; Advanced functional materials; 3D printing
• ISSN: 0079-6425; 1873-2208
• DOI: 10.1016/j.pmatsci.2022.100945

In recent years, the industries and researchers have demonstrated a strong interest in 3D (3-dimensional) printed electronics due to their tremendous potentials to deliver unique features not attainable by traditional manufacturing methods. This latest technology is potentially revolutionary, and the upcoming research trend is inclining towards 3D embedded electrical devices, 3D conformal electronics, flexible 3D printed electronics and stretchable 3D printed electronics applications. A deep understanding of the advanced functional materials for the fabrication of 3D printing electronic devices is also important since there are so many different types of inks that exist. This review offers an in-depth overview for the latest 3D electronic printing techniques and developments in innovative practical technologies used to fabricate 3D printed electronics devices. The latest progress in the advanced functional materials used for fabricating 3D printed electronics devices and the upcoming application trends is thoroughly discussed too.