Intermetallic compound formation between lead-free solders (Sn) and Cu or Ni electrodes

A kinetic model based on the principle of maximum degradation rate of the total system free energy, MDR law using thermodynamic data, is proposed and successfully applied to the selection of the first intermetallic compound (IMC) phase in Cu/Sn and Ni/Sn diffusion couples. The first phases predicted...

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Bibliographic Details
Published inMaterials letters Vol. 61; no. 10; pp. 2093 - 2095
Main Authors Sasaki, Tsutomu, Tanaka, Masamoto, Ohno, Yasuhide
Format Journal Article
LanguageEnglish
Published Elsevier B.V 01.04.2007
Subjects
Interfacial reaction
Intermetallic compound
Cu
Interfacial reaction
Sn
Ni
Intermetallic compound
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Summary:A kinetic model based on the principle of maximum degradation rate of the total system free energy, MDR law using thermodynamic data, is proposed and successfully applied to the selection of the first intermetallic compound (IMC) phase in Cu/Sn and Ni/Sn diffusion couples. The first phases predicted with this model for Cu/Sn and Ni/Sn are Cu 6Sn 5 and Ni 3Sn 4, respectively, resulting in good agreement with experimental observations.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0167-577X
1873-4979
DOI:10.1016/j.matlet.2006.08.021