Research status and development trend of preparation technology of ceramic particle dispersion strengthened copper-matrix composites

Copper is equipped with excellent electrical and thermal properties. However, its poor mechanical properties and poor high-temperature stability prevent its extensive used in structural materials. Therefore, establishing an effective strengthening method that enables copper to increase its strength...

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Published inJournal of alloys and compounds Vol. 848; p. 156475
Main Authors Qin, Yong–Qiang, Tian, Yu, Peng, Yu–Qiang, Luo, Lai–Ma, Zan, Xiang, Xu, Qiu, Wu, Yu–Cheng
Format Journal Article
LanguageEnglish
Published Lausanne Elsevier B.V 25.12.2020
Elsevier BV
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ISSN0925-8388
1873-4669
DOI10.1016/j.jallcom.2020.156475

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Summary:Copper is equipped with excellent electrical and thermal properties. However, its poor mechanical properties and poor high-temperature stability prevent its extensive used in structural materials. Therefore, establishing an effective strengthening method that enables copper to increase its strength and high-temperature tolerance can promote wide-ranging copper applications. An effective method is the addition of ceramic particles as a reinforcement phase to improve the mechanical properties of copper. The preparation processes of several ceramic particles reinforced copper-based composites are discussed in this paper, including three powder metallurgy processes as mechanical alloying, internal oxidation, and wet chemistry, as well as friction stir processing, reactive spray deposition, and liquidus in situ reaction. The effects of each process on the mechanical properties of copper-matrix composites are introduced. •Preparation of copper-matrix composites reinforced by the second phase is reviewed.•Mechanical alloying has the characteristics of simple process and low production cost.•Ti, La, and so on in CMCs is of great significance for improving the stability and strength of copper.•Friction stir process is mainly used to modify copper surface.
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ISSN:0925-8388
1873-4669
DOI:10.1016/j.jallcom.2020.156475