A novel approach of mechanical chemical grinding

• Published in: Journal of alloys and compounds Vol. 726; pp. 514 - 524
• Main Authors: Zhang, Zhenyu, Cui, Junfeng, Wang, Bo, Wang, Ziguang, Kang, Renke, Guo, Dongming
• Format: Journal Article
• Language: English
• Published: Lausanne Elsevier B.V 05.12.2017; Elsevier BV
• Subjects: Ceria; Cerium oxides; Chemicals; Damage detection; Diamonds; Diffraction; Feed rate; Grinding; Grinding wheels; Mechanical chemical grinding; Raman spectra; Silicon; Silicon dioxide; Transmission electron microscopy; Wear; X ray photoelectron spectroscopy; X-ray diffraction; X-ray diffraction; Mechanical chemical grinding; Silicon; Transmission electron microscopy; Ceria
• ISSN: 0925-8388; 1873-4669
• DOI: 10.1016/j.jallcom.2017.08.024

In this study, two diamond wheels are newly developed. A novel approach of mechanical chemical grinding (MCG) is proposed using the diamond wheel (C2) with ceria (CeO2) developed. A uniform wear layer of 48 nm in thickness is obtained on a silicon (Si) wafer ground by the C2 at a feed rate of 12 μm/min, which is less than one third that formed by a conventional diamond wheel with mesh size of 5000. The uniform wear layer consists of a 40 nm amorphous layer at the top and an 8 nm damage crystalline layer beneath. Si, silica (SiO2) and SiOx are identified on all the ground Si wafers by energy dispersive spectroscopy, X-ray diffraction (XRD), X-ray photoelectron spectroscopy and Raman spectra. Only CeO2 and diamond are confirmed by XRD on the C2, indicating the perfect vitrified effect. CeO2, diamond and amorphous carbon are discerned by Raman spectra on the C2 at 466, 1332 and 1430 cm−1, respectively. [Display omitted] •A novel approach of mechanical chemical grinding (MCG) is proposed.•A novel diamond wheel with ceria is developed.•A uniform wear layer of 48 nm in thickness is obtained, which is ground at a feed rate of 12 μm/min.