田艳红, 田. 王. (2008). Effect of solidification on solder bump formation in solder jet process： Simulation and experiment. Transactions of Nonferrous Metals Society of China, 18(5), 1201-1208. https://doi.org/10.1016/S1003-6326(08)60205-8
Chicago Style (17th ed.) Citation田艳红, 田德文 王春青. "Effect of Solidification on Solder Bump Formation in Solder Jet Process： Simulation and Experiment." Transactions of Nonferrous Metals Society of China 18, no. 5 (2008): 1201-1208. https://doi.org/10.1016/S1003-6326(08)60205-8.
MLA (9th ed.) Citation田艳红, 田德文 王春青. "Effect of Solidification on Solder Bump Formation in Solder Jet Process： Simulation and Experiment." Transactions of Nonferrous Metals Society of China, vol. 18, no. 5, 2008, pp. 1201-1208, https://doi.org/10.1016/S1003-6326(08)60205-8.