Effect of solidification on solder bump formation in solder jet process： Simulation and experiment

• Published in: Transactions of Nonferrous Metals Society of China Vol. 18; no. 5; pp. 1201 - 1208
• Main Author: 田德文 王春青 田艳红
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 01.10.2008; School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China
• Subjects: simulation; solder bump; solder jet; solidification; VOF; volume of fluid(VOF); 焊接喷射; 焊接技术; 焊接碰撞; volume of fluid(VOF); solder bump; solder jet; solidification; simulation
• ISSN: 1003-6326
• DOI: 10.1016/S1003-6326(08)60205-8

To investigate the influence of the solidification on the solder bump formation in the solder jet process, the volume of fluid （VOF） models of the solder droplets impinging onto the fluxed and non-fluxed substrates were presented. The high speed camera was used to record the solder impingement and examine the validity of the model. The results show that the complete rebound occurs during the process of the solder droplet impinging onto the fluxed substrate, whereas a cone-shaped solder bump forms during the process of the solder droplet impinging onto the non-fluxed substrate. Moreover, the solder solidification results in the lift-up of the splat periphery and the reduction in the maximum spread factor.