Optoelectronic component arrays for optical interconnection of circuits and subsystems

• Published in: Journal of lightwave technology Vol. 9; no. 12; pp. 1639 - 1645
• Main Authors: Goodwin, M.J., Moseley, A.J., Kearly, M.Q., Morris, R.C., Kirkby, C.J.G., Thompson, J., Goodfellow, R.C., Bennion, I.
• Format: Journal Article
• Language: English
• Published: New York, NY IEEE 01.12.1991; Institute of Electrical and Electronics Engineers
• Subjects: Applied sciences; Bonding; Circuit properties; Circuits; Electric, optical and optoelectronic circuits; Electronics; Exact sciences and technology; Integrated optoelectronics. Optoelectronic circuits; Optical and optoelectronic circuits; Optical arrays; Optical design; Optical devices; Optical interconnections; Optical modulation; Position measurement; Sensor arrays; Very large scale integration; Interface properties; VLSI circuit; Layout; System response; Optical modulator; Optoelectronic device; Silicon; Performance; Modeling; Optical interconnection; Reflectance
• ISSN: 0733-8724; 1558-2213
• DOI: 10.1109/50.108708

The design and performance of arrays of hybrid optoelectronic detector and modulator elements for use as optical input and output pads for chip- and board-level optical interconnects are discussed. The application of these interface arrays to specific VLSI circuits is discussed, illustrating the potential improvements in performance levels. This solder bond technique is capable of very accurate component positioning at points across the entire surface of the VLSI circuit, so that precise alignment to the optical pathways can be envisaged with optical signals taken from or delivered to any position on the chip. Measurements presented indicate that submicron positioning can be achieved. In particular, a fabrication-tolerant modulator design incorporating a chirped semiconductor mirror is reported.< >