Establishing copper‐zinc alloying strategy via active screen plasma toward stabilized zinc metal anode

• Published in: EcoMat (Beijing, China) Vol. 5; no. 5
• Main Authors: Wang, Zhen, Wang, Kehua, Zhu, Xiao, Huang, Zhiquan, Chen, Daming, Sun, Shangqi, Chen, Jian
• Format: Journal Article
• Language: English
• Published: Hoboken, USA John Wiley & Sons, Inc 01.05.2023; Wiley
• Subjects: active screen plasma; Alloying; Alloys; Anodes; Anodic coatings; Atoms & subatomic particles; Controllability; Copper; Copper base alloys; Copper zinc alloys; CuZn5 alloy; Diffusion coating; Electric fields; Electrode polarization; Electrodes; Electrolytes; Energy storage; Ion diffusion; Morphology; Plasma; Solvation; Systems analysis; Thickness; Vaporization; Zinc; Zn anode
• ISSN: 2567-3173; 2567-3173
• DOI: 10.1002/eom2.12328

The problematic Zn dendrite for Zn anodes remains a great challenge. Constructing an artificial Cu‐Zn alloy layer is one of the most potential solutions. However, it is still challenging to prepare an ideal Cu‐Zn alloy layer with good morphology and controllable thickness. Herein, a special plasma‐based method of active screen plasma (ASP) is first reported to create a hexagonal close‐packed CuZn5 alloy layer with controllable morphology and thickness. Meanwhile, a “vaporization‐redeposition” mode is proposed to illustrate the alloying process. Based upon system analysis, the CuZn5 layer with good uniformity and appropriate thickness can regulate the behavior of Zn‐ion at electrode/electrolyte interface. The former homogenizes the electric field distribution, while the latter enhances de‐solvation ability of Zn‐ion, facilitating Zn‐ion diffusion. Consequently, the CuZn5‐coated Zn anodes display lower polarization potential and longer cycling life. Such CuZn5‐coated Zn anodes enable an outstanding cycle stability for Zn‐based devices, and the pouch devices also deliver practicality. A novel plasma‐based method of active screen plasma is reported to create a Cu‐Zn alloy layer with controllable morphology and thickness. Meanwhile, a “vaporization‐redeposition” mode is proposed to illustrate the alloying process. The Cu‐Zn alloy layers can regulate the Zn deposition behavior at electrode/electrolyte interface for the achievement of long‐life rechargeable Zn‐based devices.