Understanding the Processing Quality Problem for Cutting Ceramic Materials Using the Thermal-Controlled Fracture Method Induced by a Single-Surface Heat Source

• Published in: Micromachines (Basel) Vol. 15; no. 8; p. 957
• Main Authors: Cheng, Xiaoliang, Cui, Zhenzhen, Chen, Junwen, Wang, Yang, Yang, Lijun
• Format: Journal Article
• Language: English
• Published: Switzerland MDPI AG 26.07.2024; MDPI
• Subjects: Ceramic materials; Ceramics; Crack propagation; Dielectric properties; Graphite; Heating; High temperature effects; Industrial applications; Lasers; Methods; processing problem; Propagation; Propagation modes; Protective coatings; Quality management; Silicon wafers; simulation; Stress distribution; Stress propagation; surface heating mode; Thermal simulation; Thermal stress; thermal-controlled fracture method; trajectory deviation; surface heating mode; processing problem; uneven distribution; fracture quality; simulation; ceramic materials; thermal-controlled fracture method; trajectory deviation
• ISSN: 2072-666X; 2072-666X
• DOI: 10.3390/mi15080957

The thermal-controlled fracture method has been increasingly focused upon in the high-quality cutting of advanced ceramic materials due to its excellent characteristics. The successful application of this method in cutting ceramics mainly depends on the volumetric heating effect. However, most ceramics are treated using the surface heating mode. For the surface heating mode, the processing quality, including fracture trajectory and fracture quality, is far lower than the industrial application standards. This work was conducted to reveal the mechanism of this processing quality. Experiments involving cutting ceramics in single-surface heating mode indicate that the fracture trajectories of the upper and lower surfaces display a significant inconsistency, and the fracture quality is worse than that using the dual-surface heating mode. A cutting model was established to calculate the thermal stress distribution and to simulate the crack-propagation behaviors. The simulation results show good agreement with the experiment and provide the stress distribution, and are used to understand the reason for the processing quality problem. The mechanism of the trajectory deviation and uneven distribution of the fracture quality is revealed based on the simulation and calculation results. This study helps provide a deep understanding of the processing problems arising from this method and thus helps to innovate high-quality processing methods in this field.