Screening Scheme Evaluation of the Assembly Process Based on the Stress-Strength Model and Defect Stream Analysis
During the assembly process, there are inevitable variations and noise factors in the material properties, process parameters and screening scheme, which may affect the quality of the product. Using the stress-strength model, an evaluated screening scheme method, by analyzing the variation of the de...
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| Published in | Entropy (Basel, Switzerland) Vol. 20; no. 6; p. 447 |
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| Main Authors | , , , |
| Format | Journal Article |
| Language | English |
| Published |
Switzerland
MDPI
07.06.2018
MDPI AG |
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| ISSN | 1099-4300 1099-4300 |
| DOI | 10.3390/e20060447 |
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| Abstract | During the assembly process, there are inevitable variations and noise factors in the material properties, process parameters and screening scheme, which may affect the quality of the product. Using the stress-strength model, an evaluated screening scheme method, by analyzing the variation of the defect density in the assembly process, is proposed and discussed. The influence of screening stress on product defects is considered to determine the screening scheme. We performed the defect stream analysis by calculating the recursive relations of residual defect density under multi-stress conditions. We find that the probability density function, which shows the defect changing process from latent to dominant relative to the time process, agrees very well with the historical data. We also calculate the risk as the entropy of the assembly task. Finally, we verify our method by analyzing the assembly process of a certain product. |
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| AbstractList | During the assembly process, there are inevitable variations and noise factors in the material properties, process parameters and screening scheme, which may affect the quality of the product. Using the stress-strength model, an evaluated screening scheme method, by analyzing the variation of the defect density in the assembly process, is proposed and discussed. The influence of screening stress on product defects is considered to determine the screening scheme. We performed the defect stream analysis by calculating the recursive relations of residual defect density under multi-stress conditions. We find that the probability density function, which shows the defect changing process from latent to dominant relative to the time process, agrees very well with the historical data. We also calculate the risk as the entropy of the assembly task. Finally, we verify our method by analyzing the assembly process of a certain product. During the assembly process, there are inevitable variations and noise factors in the material properties, process parameters and screening scheme, which may affect the quality of the product. Using the stress-strength model, an evaluated screening scheme method, by analyzing the variation of the defect density in the assembly process, is proposed and discussed. The influence of screening stress on product defects is considered to determine the screening scheme. We performed the defect stream analysis by calculating the recursive relations of residual defect density under multi-stress conditions. We find that the probability density function, which shows the defect changing process from latent to dominant relative to the time process, agrees very well with the historical data. We also calculate the risk as the entropy of the assembly task. Finally, we verify our method by analyzing the assembly process of a certain product.During the assembly process, there are inevitable variations and noise factors in the material properties, process parameters and screening scheme, which may affect the quality of the product. Using the stress-strength model, an evaluated screening scheme method, by analyzing the variation of the defect density in the assembly process, is proposed and discussed. The influence of screening stress on product defects is considered to determine the screening scheme. We performed the defect stream analysis by calculating the recursive relations of residual defect density under multi-stress conditions. We find that the probability density function, which shows the defect changing process from latent to dominant relative to the time process, agrees very well with the historical data. We also calculate the risk as the entropy of the assembly task. Finally, we verify our method by analyzing the assembly process of a certain product. |
| Author | Liu, Lianxi Zhao, Yu Dai, Wei Huang, Yubing |
| AuthorAffiliation | 1 School of Reliability and Systems Engineering, Beihang University, Beijing 100191, China 2 Beijing Xinghang Mechanical-Electrical Equipment Co., Beijing 10091, China |
| AuthorAffiliation_xml | – name: 2 Beijing Xinghang Mechanical-Electrical Equipment Co., Beijing 10091, China – name: 1 School of Reliability and Systems Engineering, Beihang University, Beijing 100191, China |
| Author_xml | – sequence: 1 givenname: Yubing surname: Huang fullname: Huang, Yubing – sequence: 2 givenname: Wei orcidid: 0000-0002-7376-6977 surname: Dai fullname: Dai, Wei – sequence: 3 givenname: Lianxi surname: Liu fullname: Liu, Lianxi – sequence: 4 givenname: Yu surname: Zhao fullname: Zhao, Yu |
| BackLink | https://www.ncbi.nlm.nih.gov/pubmed/33265537$$D View this record in MEDLINE/PubMed |
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| Cites_doi | 10.1080/0740817X.2014.955152 10.1016/j.ejor.2010.05.001 10.1016/j.cie.2018.03.002 10.1016/j.apt.2014.11.001 10.1109/QR2MSE.2013.6625539 10.1016/j.cja.2016.08.014 10.1002/qre.524 10.3390/s131013521 10.1016/j.microrel.2007.08.001 10.3390/e20030164 10.1016/j.procir.2017.01.035 10.1239/jap/1245676092 10.1016/j.ress.2012.10.001 10.1007/978-1-4471-5028-2 10.1239/jap/1300198148 10.1016/j.amc.2005.04.050 10.1109/EPTC.2014.7028353 10.1109/TR.2011.2170253 10.1109/IRPS.2017.7936409 10.1016/j.ress.2015.06.005 10.3390/ma11040497 10.1007/s10854-015-3263-1 10.1109/TSM.2005.852110 10.1080/0740817X.2010.491502 10.1109/TR.2002.804486 10.1016/j.ress.2012.07.004 |
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| Keywords | screening evaluation assembly process entropy defect stream stress-strength model |
| Language | English |
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| Title | Screening Scheme Evaluation of the Assembly Process Based on the Stress-Strength Model and Defect Stream Analysis |
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