Screening Scheme Evaluation of the Assembly Process Based on the Stress-Strength Model and Defect Stream Analysis

• Published in: Entropy (Basel, Switzerland) Vol. 20; no. 6; p. 447
• Main Authors: Huang, Yubing, Dai, Wei, Liu, Lianxi, Zhao, Yu
• Format: Journal Article
• Language: English
• Published: Switzerland MDPI 07.06.2018; MDPI AG
• Subjects: assembly process; defect stream; entropy; screening evaluation; stress-strength model; screening evaluation; assembly process; entropy; defect stream; stress-strength model
• ISSN: 1099-4300; 1099-4300
• DOI: 10.3390/e20060447

During the assembly process, there are inevitable variations and noise factors in the material properties, process parameters and screening scheme, which may affect the quality of the product. Using the stress-strength model, an evaluated screening scheme method, by analyzing the variation of the defect density in the assembly process, is proposed and discussed. The influence of screening stress on product defects is considered to determine the screening scheme. We performed the defect stream analysis by calculating the recursive relations of residual defect density under multi-stress conditions. We find that the probability density function, which shows the defect changing process from latent to dominant relative to the time process, agrees very well with the historical data. We also calculate the risk as the entropy of the assembly task. Finally, we verify our method by analyzing the assembly process of a certain product.