Enhancing the Performance of Germanium Channel nMOSFET Using Phosphorus Dopant Segregation

In this letter, we present a high performance Ge n-channel metal-oxide-semiconductor field-effect transistor (MOSFET) with a NiGe Schottky junction source/drain fabricated using phosphorus dopant segregation. Phosphorus atoms were implanted into NiGe and then driven toward the NiGe/p-Ge interface to...

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Bibliographic Details
Published inIEEE electron device letters Vol. 35; no. 1; pp. 6 - 8
Main Authors CHEN, Che-Wei, TZENG, Ju-Yuan, CHUNG, Cheng-Ting, CHIEN, Hung-Pin, CHIEN, Chao-Hsin, LUO, Guang-Li, WANG, Pei-Yu, TSUI, Bing-Yue
Format Journal Article
LanguageEnglish
Published New York, NY IEEE 01.01.2014
Institute of Electrical and Electronics Engineers
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Summary:In this letter, we present a high performance Ge n-channel metal-oxide-semiconductor field-effect transistor (MOSFET) with a NiGe Schottky junction source/drain fabricated using phosphorus dopant segregation. Phosphorus atoms were implanted into NiGe and then driven toward the NiGe/p-Ge interface to depin the Fermi level and form a Schottky junction. A high effective barrier height (Φ Bp ) of 0.57 eV, resulting in a high junction current ratio of at the applied voltage |V a | = ±1 V. The nMOSFET exhibited a high I ON /I OFF ratio of ~ 8×10 3 (I D ), ~ 10 5 (I S ), and a subthreshold swing of 138 mV/decade. The nMOSFET developed in this letter exhibited greater transconductance and a drain leakage current that is more than two orders of magnitude lower compared with nMOSFETs with the conventional n + /p junction.
ISSN:0741-3106
1558-0563
DOI:10.1109/LED.2013.2291774