Monitoring microstructure and phase transitions in thin films by high-temperature resistivity measurements

• Published in: Surface and interface analysis Vol. 44; no. 8; pp. 1162 - 1165
• Main Authors: Duguet, Thomas, Senocq, François, Aloui, Lyacine, Haidara, Fanta, Samélor, Diane, Mangelinck, Dominique, Vahlas, Constantin
• Format: Journal Article Conference Proceeding
• Language: English
• Published: Chichester, UK John Wiley & Sons, Ltd 01.08.2012; Wiley; Wiley-Blackwell
• Subjects: aluminum; coatings; Condensed matter: electronic structure, electrical, magnetic, and optical properties; Condensed matter: structure, mechanical and thermal properties; copper; Cross-disciplinary physics: materials science; rheology; Engineering Sciences; Exact sciences and technology; high temperature; intermetallics; Materials; metallorganic chemical vapour deposition; MOCVD; Physics; platinum; resistivity; thin films; metallorganic chemical vapour deposition; Electrical conductivity; Intermetallic compounds; Phase transformations; Aluminium; aluminum; MOCVD; high temperature; Film growth; Thin films; CVD; intermetallics; coatings; Platinum; Transition elements; Copper; Microstructure; resistivity; Aluminum; Resistivity; Intermetallics; High temperature; Coatings; Metallorganic chemical vapour deposition
• ISSN: 0142-2421; 1096-9918
• DOI: 10.1002/sia.4854

We present first experimental results obtained with a newly patented high‐temperature resistivity measurement apparatus. This technique is of great interest for monitoring the behaviour of a surface layer submitted to high temperature, either during its processing or while the functional surface is used. The innovation resides in the combination of features that are available commercially or have previously been reported by research groups worldwide, but isolated. Resistivity measurements can be performed under vacuum or controlled atmosphere, from room temperature to 1250 °C, on samples as low as 10 × 10 mm2 in size. Technical details about the apparatus are presented. Then, we show that high‐temperature resistivity measurements performed on a platinum sheet compare well with available data, and validate the prototype measurement head. Finally, we explore the monitoring of phase transitions occurring in an Al/Cu bilayer processed by metallorganic chemical vapour deposition, while a temperature ramp is applied. The high‐temperature resistivity plot is very well explained by the following sequence of phase formation: Al + Cu → θ‐Al2Cu + Cu + Al → δ‐Al2Cu3 + γ‐Al4Cu9 + Cu → δ‐Al2Cu3 + γ‐Al4Cu9 + Cu + α‐(Cu), as determined by high‐temperature X‐ray diffraction. Copyright © 2012 John Wiley & Sons, Ltd.