Multiscale microstructural characterization of Sn-rich alloys by three dimensional (3D) X-ray synchrotron tomography and focused ion beam (FIB) tomography

Sn-rich (Pb-free) alloys serve as electrical and mechanical interconnects in electronic packaging. It is critical to quantify the microstructures of Sn-rich alloys to obtain a fundamental understanding of their properties. In this work, the intermetallic precipitates in Sn–3.5Ag and Sn–0.7Cu, and gl...

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Published inMaterials characterization Vol. 70; no. Complete; pp. 33 - 41
Main Authors Yazzie, K.E., Williams, J.J., Phillips, N.C., De Carlo, F., Chawla, N.
Format Journal Article
LanguageEnglish
Published New York, NY Elsevier Inc 01.08.2012
Elsevier
Subjects
3D materials science
Alloys
Applied sciences
Brazing. Soldering
COPPER ALLOYS
Cross-disciplinary physics: materials science; rheology
Exact sciences and technology
Focused ion beam tomography
INTERMETALLIC COMPOUNDS
ION BEAMS
Joining, thermal cutting: metallurgical aspects
LAMELLAE
LEAD ALLOYS
MATERIALS SCIENCE
Metals. Metallurgy
MICROSTRUCTURE
MORPHOLOGY
PARTICLE SIZE
Pb-free solder
Phase diagrams and microstructures developed by solidification and solid-solid phase transformations
PHOTON COMPUTED TOMOGRAPHY
Physics
Precipitates
PRECIPITATION
SOLDERED JOINTS
Solidification
SPATIAL DISTRIBUTION
Statistics
SYNCHROTRON RADIATION
Three dimensional
Tin
TIN BASE ALLOYS
Tomography
X RADIATION
X-ray tomography
X-rays
3D materials science
Focused ion beam tomography
X-ray tomography
Pb-free solder
Solder
Ion beam
Microstructure
Soldering
Online AccessGet full text

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Abstract Sn-rich (Pb-free) alloys serve as electrical and mechanical interconnects in electronic packaging. It is critical to quantify the microstructures of Sn-rich alloys to obtain a fundamental understanding of their properties. In this work, the intermetallic precipitates in Sn–3.5Ag and Sn–0.7Cu, and globular lamellae in Sn–37Pb solder joints were visualized and quantified using 3D X-ray synchrotron tomography and focused ion beam (FIB) tomography. 3D reconstructions were analyzed to extract statistics on particle size and spatial distribution. In the Sn–Pb alloy the interconnectivity of Sn-rich and Pb-rich constituents was quantified. It will be shown that multiscale characterization using 3D X-ray and FIB tomography enabled the characterization of the complex morphology, distribution, and statistics of precipitates and contiguous phases over a range of length scales. ► Multiscale characterization by X-ray synchrotron and focused ion beam tomography. ► Characterized microstructural features in several Sn-based alloys. ► Quantified size, fraction, and clustering of microstructural features.
AbstractList Sn-rich (Pb-free) alloys serve as electrical and mechanical interconnects in electronic packaging. It is critical to quantify the microstructures of Sn-rich alloys to obtain a fundamental understanding of their properties. In this work, the intermetallic precipitates in Sn-3.5Ag and Sn-0.7Cu, and globular lamellae in Sn-37Pb solder joints were visualized and quantified using 3D X-ray synchrotron tomography and focused ion beam (FIB) tomography. 3D reconstructions were analyzed to extract statistics on particle size and spatial distribution. In the Sn-Pb alloy the interconnectivity of Sn-rich and Pb-rich constituents was quantified. It will be shown that multiscale characterization using 3D X-ray and FIB tomography enabled the characterization of the complex morphology, distribution, and statistics of precipitates and contiguous phases over a range of length scales.
Sn-rich (Pb-free) alloys serve as electrical and mechanical interconnects in electronic packaging. It is critical to quantify the microstructures of Sn-rich alloys to obtain a fundamental understanding of their properties. In this work, the intermetallic precipitates in Sn–3.5Ag and Sn–0.7Cu, and globular lamellae in Sn–37Pb solder joints were visualized and quantified using 3D X-ray synchrotron tomography and focused ion beam (FIB) tomography. 3D reconstructions were analyzed to extract statistics on particle size and spatial distribution. In the Sn–Pb alloy the interconnectivity of Sn-rich and Pb-rich constituents was quantified. It will be shown that multiscale characterization using 3D X-ray and FIB tomography enabled the characterization of the complex morphology, distribution, and statistics of precipitates and contiguous phases over a range of length scales. ► Multiscale characterization by X-ray synchrotron and focused ion beam tomography. ► Characterized microstructural features in several Sn-based alloys. ► Quantified size, fraction, and clustering of microstructural features.
Sn-rich (Pb-free) alloys serve as electrical and mechanical interconnects in electronic packaging. It is critical to quantify the microstructures of Sn-rich alloys to obtain a fundamental understanding of their properties. In this work, the intermetallic precipitates in Sn-3.5Ag and Sn-0.7Cu, and globular lamellae in Sn-37Pb solder joints were visualized and quantified using 3D X-ray synchrotron tomography and focused ion beam (FIB) tomography. 3D reconstructions were analyzed to extract statistics on particle size and spatial distribution. In the Sn-Pb alloy the interconnectivity of Sn-rich and Pb-rich constituents was quantified. It will be shown that multiscale characterization using 3D X-ray and FIB tomography enabled the characterization of the complex morphology, distribution, and statistics of precipitates and contiguous phases over a range of length scales. - Highlights: Black-Right-Pointing-Pointer Multiscale characterization by X-ray synchrotron and focused ion beam tomography. Black-Right-Pointing-Pointer Characterized microstructural features in several Sn-based alloys. Black-Right-Pointing-Pointer Quantified size, fraction, and clustering of microstructural features.
Author Chawla, N.
Phillips, N.C.
De Carlo, F.
Williams, J.J.
Yazzie, K.E.
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Keywords 3D materials science
Focused ion beam tomography
X-ray tomography
Pb-free solder
Solder
Ion beam
Microstructure
Soldering
Language English
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Snippet Sn-rich (Pb-free) alloys serve as electrical and mechanical interconnects in electronic packaging. It is critical to quantify the microstructures of Sn-rich...
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StartPage 33
SubjectTerms 3D materials science
Alloys
Applied sciences
Brazing. Soldering
COPPER ALLOYS
Cross-disciplinary physics: materials science; rheology
Exact sciences and technology
Focused ion beam tomography
INTERMETALLIC COMPOUNDS
ION BEAMS
Joining, thermal cutting: metallurgical aspects
LAMELLAE
LEAD ALLOYS
MATERIALS SCIENCE
Metals. Metallurgy
MICROSTRUCTURE
MORPHOLOGY
PARTICLE SIZE
Pb-free solder
Phase diagrams and microstructures developed by solidification and solid-solid phase transformations
PHOTON COMPUTED TOMOGRAPHY
Physics
Precipitates
PRECIPITATION
SOLDERED JOINTS
Solidification
SPATIAL DISTRIBUTION
Statistics
SYNCHROTRON RADIATION
Three dimensional
Tin
TIN BASE ALLOYS
Tomography
X RADIATION
X-ray tomography
X-rays
Title Multiscale microstructural characterization of Sn-rich alloys by three dimensional (3D) X-ray synchrotron tomography and focused ion beam (FIB) tomography
URI https://dx.doi.org/10.1016/j.matchar.2012.05.004
https://search.proquest.com/docview/1038302167
https://www.osti.gov/biblio/22066479
Volume 70
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