Multiscale microstructural characterization of Sn-rich alloys by three dimensional (3D) X-ray synchrotron tomography and focused ion beam (FIB) tomography

Sn-rich (Pb-free) alloys serve as electrical and mechanical interconnects in electronic packaging. It is critical to quantify the microstructures of Sn-rich alloys to obtain a fundamental understanding of their properties. In this work, the intermetallic precipitates in Sn–3.5Ag and Sn–0.7Cu, and gl...

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Published inMaterials characterization Vol. 70; no. Complete; pp. 33 - 41
Main Authors Yazzie, K.E., Williams, J.J., Phillips, N.C., De Carlo, F., Chawla, N.
Format Journal Article
LanguageEnglish
Published New York, NY Elsevier Inc 01.08.2012
Elsevier
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Summary:Sn-rich (Pb-free) alloys serve as electrical and mechanical interconnects in electronic packaging. It is critical to quantify the microstructures of Sn-rich alloys to obtain a fundamental understanding of their properties. In this work, the intermetallic precipitates in Sn–3.5Ag and Sn–0.7Cu, and globular lamellae in Sn–37Pb solder joints were visualized and quantified using 3D X-ray synchrotron tomography and focused ion beam (FIB) tomography. 3D reconstructions were analyzed to extract statistics on particle size and spatial distribution. In the Sn–Pb alloy the interconnectivity of Sn-rich and Pb-rich constituents was quantified. It will be shown that multiscale characterization using 3D X-ray and FIB tomography enabled the characterization of the complex morphology, distribution, and statistics of precipitates and contiguous phases over a range of length scales. ► Multiscale characterization by X-ray synchrotron and focused ion beam tomography. ► Characterized microstructural features in several Sn-based alloys. ► Quantified size, fraction, and clustering of microstructural features.
Bibliography:ObjectType-Article-2
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ISSN:1044-5803
1873-4189
DOI:10.1016/j.matchar.2012.05.004