Multiscale microstructural characterization of Sn-rich alloys by three dimensional (3D) X-ray synchrotron tomography and focused ion beam (FIB) tomography
Sn-rich (Pb-free) alloys serve as electrical and mechanical interconnects in electronic packaging. It is critical to quantify the microstructures of Sn-rich alloys to obtain a fundamental understanding of their properties. In this work, the intermetallic precipitates in Sn–3.5Ag and Sn–0.7Cu, and gl...
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Published in | Materials characterization Vol. 70; no. Complete; pp. 33 - 41 |
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Main Authors | , , , , |
Format | Journal Article |
Language | English |
Published |
New York, NY
Elsevier Inc
01.08.2012
Elsevier |
Subjects | |
Online Access | Get full text |
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Summary: | Sn-rich (Pb-free) alloys serve as electrical and mechanical interconnects in electronic packaging. It is critical to quantify the microstructures of Sn-rich alloys to obtain a fundamental understanding of their properties. In this work, the intermetallic precipitates in Sn–3.5Ag and Sn–0.7Cu, and globular lamellae in Sn–37Pb solder joints were visualized and quantified using 3D X-ray synchrotron tomography and focused ion beam (FIB) tomography. 3D reconstructions were analyzed to extract statistics on particle size and spatial distribution. In the Sn–Pb alloy the interconnectivity of Sn-rich and Pb-rich constituents was quantified. It will be shown that multiscale characterization using 3D X-ray and FIB tomography enabled the characterization of the complex morphology, distribution, and statistics of precipitates and contiguous phases over a range of length scales.
► Multiscale characterization by X-ray synchrotron and focused ion beam tomography. ► Characterized microstructural features in several Sn-based alloys. ► Quantified size, fraction, and clustering of microstructural features. |
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Bibliography: | ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 23 |
ISSN: | 1044-5803 1873-4189 |
DOI: | 10.1016/j.matchar.2012.05.004 |