Direct bonding of copper and liquid crystal polymer

•Developed a facile two-step, activation process for liquid crystal polymer (LCP) and copper (Cu) bonding.•Achieved high peel strength (683 g.cm−1) through interdiffusion of Cu and carbon atoms.•Observed three-dimensional metal clusters of Cu atoms and islands at the LCP/Cu interface.•Interfacial in...

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Bibliographic Details
Published inMaterials letters Vol. 212; pp. 214 - 217
Main Authors Redhwan, Taufique Z., Alam, Arif U., Catalano, Massimo, Wang, Luhua, Kim, Moon J., Haddara, Yaser M., Howlader, Matiar M.R.
Format Journal Article
LanguageEnglish
Published Amsterdam Elsevier B.V 01.02.2018
Elsevier BV
Subjects
Adhesion
Adhesive strength
Bonding strength
Copper
Copper and liquid crystal polymer
Diffusion
Dimensional stability
Elemental and morphological characterization
Interdiffusion
Liquid crystal polymers
Liquid crystals
Low temperature bonding
Materials science
Metal clusters
Oxygen plasma
Peel strength
Polymer films
Polymers
Studies
Substrates
Surface activation
Surface activation
Low temperature bonding
Copper and liquid crystal polymer
Diffusion
Adhesion
Elemental and morphological characterization
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ISSN0167-577X
1873-4979
DOI10.1016/j.matlet.2017.10.099

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Summary:•Developed a facile two-step, activation process for liquid crystal polymer (LCP) and copper (Cu) bonding.•Achieved high peel strength (683 g.cm−1) through interdiffusion of Cu and carbon atoms.•Observed three-dimensional metal clusters of Cu atoms and islands at the LCP/Cu interface.•Interfacial intermediate oxide layer was characterized in terms of Cu2O and CO. Copper (Cu) film bonded with polymer substrates offers better dimensional stability than that of deposited Cu especially in humid environment. However, poor adhesion is an issue in both cases. In this paper, we demonstrate a two-step, low temperature direct bonding technique for liquid crystal polymer (LCP) and copper (Cu) using oxygen plasma. The bonded interface showed high peel strength. This strong adhesion is due to the interdiffusion of Cu and carbon atoms into LCP and Cu film respectively. These phenomena resulted in three-dimensional metal clusters of Cu atoms and islands at the LCP/Cu interface, which gradually diffuse into the LCP. Interfacial elemental analysis reveals an intermediate oxide layer formation due to Cu2O and CO.
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ISSN:0167-577X
1873-4979
DOI:10.1016/j.matlet.2017.10.099