Tensile creep characteristics of Sn–3.5Ag–0.5Cu (SAC355) solder reinforced with nano-metric ZnO particles

• Published in: Materials science & engineering. A, Structural materials : properties, microstructure and processing Vol. 603; pp. 1 - 10
• Main Authors: Fawzy, A., Fayek, S.A., Sobhy, M., Nassr, E., Mousa, M.M., Saad, G.
• Format: Journal Article
• Language: English
• Published: Kidlington Elsevier B.V 06.05.2014; Elsevier
• Subjects: Applied sciences; Brazing. Soldering; Composite solder; Creep; Creep resistance; Elasticity. Plasticity; Electronics; Exact sciences and technology; Joining, thermal cutting: metallurgical aspects; Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology; Metals. Metallurgy; Microelectronic fabrication (materials and surfaces technology); Nano-metric; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Structural refinement; Structural refinement; Creep resistance; Composite solder; Nano-metric; Grain size; Particle size; Creep; Volume fraction; Nanoparticle; Intermetallic compound; Creep strength; Tension test; Composite material; Tensile strength; Solder; Lifetime; Electronic packaging; Soldered joint; Growth mechanism; Metric; Soldering; Melting point
• ISSN: 0921-5093; 1873-4936
• DOI: 10.1016/j.msea.2014.02.061

Recently, nano-composite solders have been developed in the electronic packaging materials industry to improve the mechanical response of solder joints to be used in service under different conditions. In this study mechanical mixing has been used to disperse nano-metric ZnO particles in Sn–3.5Ag–0.5Cu (SAC355) solder at 420°C for 2h. In comparison with SAC355 solder, addition of nano-metric ZnO particles effectively suppressed the formation and restricted the volume fraction of the Ag3Sn and Cu6Sn5 intermetallic compound particles, lowering grain sizes and controlled the growth of β-Sn grains in the matrix. An improvement in tensile creep resistance of the reinforced SAC355 composite is noticed. This improvement seems to be due to its effect in structural refinement and makes the composite solder to display a large creep life time. The addition of nano-metric ZnO particles keeps the melting temperature nearly at the SAC355 level, indicating that the composite solder is fit for the existing soldering process.