Novel Cu–Nb-wires: Processing and characterisation

• Published in: Materials science & engineering. A, Structural materials : properties, microstructure and processing Vol. 416; no. 1; pp. 261 - 268
• Main Authors: Botcharova, E., Freudenberger, J., Gaganov, A., Khlopkov, K., Schultz, L.
• Format: Journal Article
• Language: English
• Published: Amsterdam Elsevier B.V 25.01.2006; Elsevier
• Subjects: Condensed matter: electronic structure, electrical, magnetic, and optical properties; Condensed matter: structure, mechanical and thermal properties; Cu–Nb alloys; Electronic structure and electrical properties of surfaces, interfaces, thin films and low-dimensional structures; Electronic transport in multilayers, nanoscale materials and structures; Exact sciences and technology; High field pulsed magnets; High strength; Mechanical alloying; Mechanical and acoustical properties of condensed matter; Mechanical properties of nanoscale materials; Nanocrystalline materials; Physics; Wires; Cu–Nb alloys; High field pulsed magnets; High strength; Wires; Nanocrystalline materials; Mechanical alloying; Annealing; Electrical conductivity; Ultimate strength method; High strength alloy; Ferromagnetic materials; Niobium alloys; Wire; Heat treatments; Optimization; Tensile strength; EBSD; Transmission electron microscopy; Grain boundary slide; Cu-Nb alloys; Copper alloys; Chemical composition; Microstructure; Nanocrystal
• ISSN: 0921-5093; 1873-4936
• DOI: 10.1016/j.msea.2005.10.022

High strength Cu–Nb-conductors were prepared by mechanical alloying and subsequent heat treatment and deformation. The mechanical as well as electrical properties of the material were optimised by varying the Nb-content and also by the adjustment of the heat treatment parameters. Microstructure characterisation was carried out by SEM including EBSD, TEM and X-ray measurements. Optimally treated material shows an ultimate tensile strength of 1210 MPa and an electrical conductivity of about 50% International Annealing Copper Standard (IACS) at room temperature. Grain-boundary sliding as a non-conventional deformation mechanism has been observed to be active in the copper matrix, which is strongly correlated to its nanocrystalline microstructure. This is associated with grain rotation as accommodation process.