Low temperature curable epoxy siloxane hybrid materials for LED encapsulant
ABSTRACT A thermally cured epoxy‐siloxane hybrid material that is curable at low temperature (L‐expoxy hybrimer) was investigated for use as an LED encapsulant. This new hybrimer was fabricated using thermally initiated, cationic polymerization of cycloaliphatic epoxy oligosiloxane (CAEO) resin, der...
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Published in | Journal of applied polymer science Vol. 131; no. 6; pp. np - n/a |
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Main Authors | , , , , |
Format | Journal Article |
Language | English |
Published |
Hoboken, NJ
Blackwell Publishing Ltd
15.03.2014
Wiley Wiley Subscription Services, Inc |
Subjects | |
Online Access | Get full text |
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Summary: | ABSTRACT
A thermally cured epoxy‐siloxane hybrid material that is curable at low temperature (L‐expoxy hybrimer) was investigated for use as an LED encapsulant. This new hybrimer was fabricated using thermally initiated, cationic polymerization of cycloaliphatic epoxy oligosiloxane (CAEO) resin, derived from non‐hydrolytic sol–gel, mixed with oxetane hardener in the presence of a hexafluoroantimonate‐type thermo‐cationic initiator. The L‐epoxy hybrimer was cured at a lower temperature (below 120°C) than previously reported for an epoxy hybrimer with anhydride hardener (above 180°C). The L‐epoxy hybrimer showed high thermal resistance to yellowing under long‐term high temperature condition, and maintained good optical transmittance. Also, it had a high refractive index (up to 1.57), as well as the hardness (Shore D 80), and low water‐vapor permeability, when the new hybrimer was used to encapsulate an LED, it showed good adhesion without cracks or delamination and maintained their initial performance after the long‐term aging tests (120 and 85°C at 85% humidity). © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2014, 131, 39968. |
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Bibliography: | Korean government (MEST) - No. 2010-0013811 National Research Foundation of Korea (NRF) ark:/67375/WNG-R0ZLFTMN-Q istex:5A8876469E353429FA7599235E5D11E029DAFCF4 ArticleID:APP39968 ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 23 |
ISSN: | 0021-8995 1097-4628 |
DOI: | 10.1002/app.39968 |