Low temperature curable epoxy siloxane hybrid materials for LED encapsulant

ABSTRACT A thermally cured epoxy‐siloxane hybrid material that is curable at low temperature (L‐expoxy hybrimer) was investigated for use as an LED encapsulant. This new hybrimer was fabricated using thermally initiated, cationic polymerization of cycloaliphatic epoxy oligosiloxane (CAEO) resin, der...

Full description

Saved in:
Bibliographic Details
Published inJournal of applied polymer science Vol. 131; no. 6; pp. np - n/a
Main Authors Kim, HweaYoon, Bae, Jun-young, Kim, Yong Ho, Kim, Yu Bae, Bae, Byeong-Soo
Format Journal Article
LanguageEnglish
Published Hoboken, NJ Blackwell Publishing Ltd 15.03.2014
Wiley
Wiley Subscription Services, Inc
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:ABSTRACT A thermally cured epoxy‐siloxane hybrid material that is curable at low temperature (L‐expoxy hybrimer) was investigated for use as an LED encapsulant. This new hybrimer was fabricated using thermally initiated, cationic polymerization of cycloaliphatic epoxy oligosiloxane (CAEO) resin, derived from non‐hydrolytic sol–gel, mixed with oxetane hardener in the presence of a hexafluoroantimonate‐type thermo‐cationic initiator. The L‐epoxy hybrimer was cured at a lower temperature (below 120°C) than previously reported for an epoxy hybrimer with anhydride hardener (above 180°C). The L‐epoxy hybrimer showed high thermal resistance to yellowing under long‐term high temperature condition, and maintained good optical transmittance. Also, it had a high refractive index (up to 1.57), as well as the hardness (Shore D 80), and low water‐vapor permeability, when the new hybrimer was used to encapsulate an LED, it showed good adhesion without cracks or delamination and maintained their initial performance after the long‐term aging tests (120 and 85°C at 85% humidity). © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2014, 131, 39968.
Bibliography:Korean government (MEST) - No. 2010-0013811
National Research Foundation of Korea (NRF)
ark:/67375/WNG-R0ZLFTMN-Q
istex:5A8876469E353429FA7599235E5D11E029DAFCF4
ArticleID:APP39968
ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0021-8995
1097-4628
DOI:10.1002/app.39968