Novel dielectric behaviors in PVDF-based semiconductor composites
Composites of polyvinylidene fluoride (PVDF) filled with different conductive fillers as carbon black (CB), nickel (Ni), zinc (Zn), and tungsten (W), respectively, were prepared at same processing condition. The temperature dependence of dielectric behaviors of composites was studied at wide filler...
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Published in | Journal of applied polymer science Vol. 122; no. 5; pp. 3466 - 3473 |
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Main Authors | , , , , |
Format | Journal Article |
Language | English |
Published |
Hoboken
Wiley Subscription Services, Inc., A Wiley Company
05.12.2011
Wiley Wiley Subscription Services, Inc |
Subjects | |
Online Access | Get full text |
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Summary: | Composites of polyvinylidene fluoride (PVDF) filled with different conductive fillers as carbon black (CB), nickel (Ni), zinc (Zn), and tungsten (W), respectively, were prepared at same processing condition. The temperature dependence of dielectric behaviors of composites was studied at wide filler concentration and wide frequency ranges. Results show that there are giant dielectric constants as the concentration of filler is near the percolation threshold. The dielectric constants of all studied composites decrease slowly with increasing of frequency and rise gradually with increasing filler contents in the composites. Two relaxation peak regions of dielectric constant are observed from −30 to 40°C and from 100 to 150°C, which can be attributed to the contribution of polar effect of PVDF. The CB filled PVDF (CB/PVDF) composites present a lower percolation threshold than other metallic‐filler filled PVDF composites. The maximal dielectric constant was found in the Ni filled PVDF (Ni/PVDF) composite. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011 |
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Bibliography: | Basic Key Research Programs of Science and Technology Commission Foundation of Shanghai City - No. 09JC1406700 ArticleID:APP34362 ark:/67375/WNG-33NP929D-W Innovation Program of Shanghai Municipal Education Commission - No. 10ZZ132 The Program for Professor of Special Appointment (Eastern Scholar) at Shanghai Institutions of Higher Learning, Alliance Program of Shanghai - No. 09LM10 istex:E839B8DAA9A47B21A2314DC18878AF133F02106D ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 23 |
ISSN: | 0021-8995 1097-4628 1097-4628 |
DOI: | 10.1002/app.34362 |