Printed copper-nanoplate conductor for electro-magnetic interference

• Published in: Nanotechnology Vol. 33; no. 11; pp. 115601 - 115606
• Main Authors: Li, Changning, Khuje, Saurabh, Petit, Donald, Huang, Yulong, Sheng, Aaron, An, Lu, Di Luigi, Massimigliano, Jalouli, Alireza, Navarro, Marieross, Islam, Abdullah, Ren, Shenqiang
• Format: Journal Article
• Language: English
• Published: England IOP Publishing 21.12.2021
• Subjects: conductive ink; copper nanoplates; high-temperature conductor; Materials Science; Physics; Science & Technology - Other Topics; size engineering; copper nanoplates; size engineering; conductive ink; high-temperature conductor
• ISSN: 0957-4484; 1361-6528
• DOI: 10.1088/1361-6528/ac40bc

As one of the conductive ink materials with high electric conductivity, elemental copper (Cu) based nanocrystals promise for printable electronics. Here, single crystalline Cu nanoplates were synthesized using a facile hydrothermal method. Size engineering of Cu nanoplates can be rationalized by using the LaMer model and the versatile Cu conductive ink materials are suitable for different printing technologies. The printed Cu traces show high electric conductivity of 6 MS m , exhibiting electro-magnetic interference shielding efficiency value of 75 dB at an average thicknesses of 11 m. Together with flexible alumina ceramic aerogel substrates, it kept 87% conductivity at the environmental temperature of 400 °C, demonstrating the potential of Cu conductive ink for high-temperature printable electronics applications.