28 GHz compact dipole antenna array integrated in fan-out eWLB package

In this paper, we present a 28 GHz antenna array in package which covers the n257 and n258 frequency bands designated for 5G applications. The dipole antenna array is placed on one of the two re-distribution layers in the fan-out eWLB (embedded Wafer Level Ball Grid Array) package. For TX and RX, se...

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Bibliographic Details
Published inInternational journal of microwave and wireless technologies Vol. 14; no. 10; pp. 1369 - 1377
Main Authors Aziz, Imran, Wu, Dapeng, Öjefors, Erik, Hanning, Johanna, Dancila, Dragos
Format Journal Article
LanguageEnglish
Published Cambridge, UK Cambridge University Press 01.12.2022
Subjects
Antenna arrays
Antenna Design, Modelling and Measurements
Antennas
Arrays
Ball grid packaging
Beam steering
Design
Dipole antennas
Fanout
Frequencies
Heat sinks
Packaging
Performance evaluation
Radiation
Silicon wafers
dipole array
fan-out antenna array
Antenna in package (AiP)
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Summary:In this paper, we present a 28 GHz antenna array in package which covers the n257 and n258 frequency bands designated for 5G applications. The dipole antenna array is placed on one of the two re-distribution layers in the fan-out eWLB (embedded Wafer Level Ball Grid Array) package. For TX and RX, separate but identical antenna arrays are placed on each side of the die. The paper presents a novel horn-shaped heatsink which not only dissipates the heat, but also improves the radiation performance. The four-elements dipole array has the impedance bandwidth of almost 6 GHz (24–30 GHz) and shows a maximum realized gain of 9.5 dBi. Beam-steering in ± 35 deg is achieved in the azimuth plane (H-plane) by providing different phases to the dipoles through the chip. The measurements nicely agree with the simulation results.
ISSN:1759-0787
1759-0795
1759-0795
DOI:10.1017/S1759078722000058