Area selective formation of magnetic nanodot arrays on Si wafer by electroless deposition

Electroless deposition process for fabricating magnetic dot arrays was studied. A patterned Si substrate with a SiO2 resist was produced by processes combined with electron-beam lithography and reactive ion etching. By immersing the patterned Si substrate into a CoNiP electroless deposition bath, Co...

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Bibliographic Details
Published inJournal of magnetism and magnetic materials Vol. 287; pp. 245 - 249
Main Authors Kawaji, J., Kitaizumi, F., Oikawa, H., Niwa, D., Homma, T., Osaka, T.
Format Journal Article Conference Proceeding
LanguageEnglish
Published Amsterdam Elsevier B.V 01.02.2005
Elsevier Science
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Summary:Electroless deposition process for fabricating magnetic dot arrays was studied. A patterned Si substrate with a SiO2 resist was produced by processes combined with electron-beam lithography and reactive ion etching. By immersing the patterned Si substrate into a CoNiP electroless deposition bath, CoNiP was deposited only into the patterned pores, demonstrating a satisfactory area selectivity of the deposition. Excellent uniformity on the CoNiP deposition into the patterned pores with diameter less than 100nm and high aspect ratio (>5) was achieved by applying chemical activation processes using a Pd solution prior to the deposition. The CoNiP dot arrays exhibited higher perpendicular squareness ratio than that of CoNiP continuous film and showed a clear magnetization state at DC-magnetized state, which originated from the shape anisotropy caused by high aspect ratio of the dot patterns.
ISSN:0304-8853
DOI:10.1016/j.jmmm.2004.10.040