A study of the underpotential deposition of copper on cetyltrimethylammonium halides covering gold nanoparticle thin films

This study presents a novel method for the synthesis of self-assembled cationic surfactants covering gold nanoparticle thin films and determines the underpotential deposition behavior of copper on such films. Based upon the solid–liquid interface penetration of copper ions through a self-assembled m...

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Bibliographic Details
Published inJournal of applied electrochemistry Vol. 45; no. 10; pp. 1133 - 1139
Main Authors Luo, Wen-Hsin, Ding, Yung-Chin, Su, I-Fong, Chang, Yu-Hsu
Format Journal Article
LanguageEnglish
Published Dordrecht Springer Netherlands 01.10.2015
Subjects
Chemistry
Chemistry and Materials Science
Electrochemistry
Electrodeposition
Industrial Chemistry/Chemical Engineering
Physical Chemistry
Research Article
Gold nanoparticle thin film
Cetyltrimethylammonium bromide
Cetyltrimethylammonium fluoride
Cetyltrimethylammonium chloride
Underpotential deposition
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Summary:This study presents a novel method for the synthesis of self-assembled cationic surfactants covering gold nanoparticle thin films and determines the underpotential deposition behavior of copper on such films. Based upon the solid–liquid interface penetration of copper ions through a self-assembled molecular layer, the variations in oxidation–reduction potential and the amount of copper ion desorption are determined, using cyclic voltammetry and linear sweep voltammetry analysis. The influence of various capping agents, cetyltrimethylammonium fluoride (CTAF), cetyltrimethylammonium chloride (CTAC), and cetyltrimethylammonium bromide (CTAB), on gold substrates is also determined. The blocking capabilities of surfactants that hinder ion penetration from the solution to the Au surface, through bilayers, are in the order: CTAB ≥ CTAC > CTAF.
ISSN:0021-891X
1572-8838
DOI:10.1007/s10800-015-0853-9