Reliability study of PCB-embedded power dies using solderless pressed metal foam

• Published in: Microelectronics and reliability Vol. 114; p. 113904
• Main Authors: Bensebaa, S., Berkani, M., Lefebvre, S., Petit, M., Schmitt, N., Zhang, S.
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 01.11.2020; Elsevier
• Subjects: Engineering Sciences
• ISSN: 0026-2714; 1872-941X
• DOI: 10.1016/j.microrel.2020.113904

This paper presents a reliability study of an innovative process of embedding power dies in PCBs. Firstly, a description of this solderless package is given. Secondly, experimental tests of thermal ageing for the proposed package are performed through passive thermal cycling in the range of PCB standards. Thirdly, a 2D finite element model of the package is built using material properties obtained from previous thermomechanical characterizations. Numerical simulations of a passive thermal cycling of the package are carried out. The analysis of the strain-stress fields allows to highlight the time-space areas where they are critical and compromise the reliability. •New process of embedding power die on PCB that uses a pressed metal foam on the top and bottom side of the die.•Package without solder joint and wire bonding.•Material characterization (Coefficient of thermal expansion CTE, Young's Modulus E).•FE analysis showed that replacing solder joint with a metal foam on the top and bottom side of the die reduces stress level.•Thermal cycling under PCB normative specifications ageing tests show a good reliability of the proposed packaging.