Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder
The influence of Activated Carbon (AC) particles on mechanical properties of Sn-Cu-Ni-xAC solder joint was investigated. Five different Activated Carbon (AC) percentage addition (0 wt. %, 0.25 wt. %, 0.5 wt. %, 0.75 wt. %, and 1.0 wt. %) were prepared via powder metallurgy (PM) technique. Interfacia...
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Published in | MATEC Web of Conferences Vol. 78; p. 1064 |
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Main Authors | , , , , |
Format | Journal Article Conference Proceeding |
Language | English |
Published |
Les Ulis
EDP Sciences
01.01.2016
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Subjects | |
Online Access | Get full text |
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Summary: | The influence of Activated Carbon (AC) particles on mechanical properties of Sn-Cu-Ni-xAC solder joint was investigated. Five different Activated Carbon (AC) percentage addition (0 wt. %, 0.25 wt. %, 0.5 wt. %, 0.75 wt. %, and 1.0 wt. %) were prepared via powder metallurgy (PM) technique. Interfacial IMC thickness measurement and shear strength results showed that with thinner IMC layer (by increasing amount of wt.% of AC), the higher the shear strength of the joint. It is believed that the AC particles suppresses the interfacial IMC growth and thus improves the shear strength. |
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ISSN: | 2261-236X 2274-7214 2261-236X |
DOI: | 10.1051/matecconf/20167801064 |