SiC power devices packaging with a short-circuit failure mode capability

• Published in: Microelectronics and reliability Vol. 76-77; pp. 400 - 404
• Main Authors: Dchar, Ilyas, Buttay, Cyril, Morel, Hervé
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 01.09.2017; Elsevier
• Subjects: Engineering Sciences

The failure mode of press-pack-type packages dedicated to SiC devices is experimentally analyzed in order to investigate their use for HVDC applications. Single SiC Schottky diode samples have been submitted to short-circuit conditions and continuous current flow test. The samples have been then cha...