System for Cooling of Electronic Components
Results of computational and experimental investigations of heat pipes having a predetermined thermal resistance and a system based on these pipes for air cooling of electronic components and diode assemblies of lasers are presented. An efficient compact cooling system comprising heat pipes with an...
Saved in:
Published in | Journal of engineering physics and thermophysics Vol. 90; no. 1; pp. 95 - 101 |
---|---|
Main Authors | , , , , , |
Format | Journal Article |
Language | English |
Published |
New York
Springer US
2017
Springer |
Subjects | |
Online Access | Get full text |
Cover
Loading…
Abstract | Results of computational and experimental investigations of heat pipes having a predetermined thermal resistance and a system based on these pipes for air cooling of electronic components and diode assemblies of lasers are presented. An efficient compact cooling system comprising heat pipes with an evaporator having a capillary coating of a caked copper powder and a condenser having a developed outer finning, has been deviced. This system makes it possible to remove, to the ambient air, a heat flow of power more than 300 W at a temperature of 40–50°C. |
---|---|
AbstractList | Results of computational and experimental investigations of heat pipes having a predetermined thermal resistance and a system based on these pipes for air cooling of electronic components and diode assemblies of lasers are presented. An efficient compact cooling system comprising heat pipes with an evaporator having a capillary coating of a caked copper powder and a condenser having a developed outer finning, has been deviced. This system makes it possible to remove, to the ambient air, a heat flow of power more than 300 W at a temperature of40-50[degrees]C. Keywords: heat pipe, evaporator, condenser, cooling, electronic components. Results of computational and experimental investigations of heat pipes having a predetermined thermal resistance and a system based on these pipes for air cooling of electronic components and diode assemblies of lasers are presented. An efficient compact cooling system comprising heat pipes with an evaporator having a capillary coating of a caked copper powder and a condenser having a developed outer finning, has been deviced. This system makes it possible to remove, to the ambient air, a heat flow of power more than 300 W at a temperature of 40-50 degree C. Results of computational and experimental investigations of heat pipes having a predetermined thermal resistance and a system based on these pipes for air cooling of electronic components and diode assemblies of lasers are presented. An efficient compact cooling system comprising heat pipes with an evaporator having a capillary coating of a caked copper powder and a condenser having a developed outer finning, has been deviced. This system makes it possible to remove, to the ambient air, a heat flow of power more than 300 W at a temperature of 40–50°C. |
Audience | Academic |
Author | Rabetskii, M. I. Vasil’ev, L. L. Olekhnovich, V. A. Grakovich, L. P. Zhuravlev, A. S. Dragun, L. A. |
Author_xml | – sequence: 1 givenname: L. L. surname: Vasil’ev fullname: Vasil’ev, L. L. organization: A. V. Luikov Heat and Mass Transfer Institute, National Academy of Sciences of Belarus – sequence: 2 givenname: L. P. surname: Grakovich fullname: Grakovich, L. P. email: lpg@itmo.by organization: A. V. Luikov Heat and Mass Transfer Institute, National Academy of Sciences of Belarus – sequence: 3 givenname: L. A. surname: Dragun fullname: Dragun, L. A. organization: A. V. Luikov Heat and Mass Transfer Institute, National Academy of Sciences of Belarus – sequence: 4 givenname: A. S. surname: Zhuravlev fullname: Zhuravlev, A. S. organization: A. V. Luikov Heat and Mass Transfer Institute, National Academy of Sciences of Belarus – sequence: 5 givenname: V. A. surname: Olekhnovich fullname: Olekhnovich, V. A. organization: A. V. Luikov Heat and Mass Transfer Institute, National Academy of Sciences of Belarus – sequence: 6 givenname: M. I. surname: Rabetskii fullname: Rabetskii, M. I. organization: A. V. Luikov Heat and Mass Transfer Institute, National Academy of Sciences of Belarus |
BookMark | eNp9kEFLwzAUx4NMcJt-AG89KtKZpEmTHseYOhgITsFbqOlr6WiTmaTgvr0Z9bKLhJDHy-__En4zNDHWAEK3BC8IxuLREywLkmIiUsJZlsoLNCVcxEKQz0mscU7jLeVXaOb9HmNcSJZN0cPu6AP0SW1dsrK2a02T2DpZd6CDs6bVsdsf4lsm-Gt0WZedh5u_c44-ntbvq5d0-_q8WS23qc4KFtKKf0ENOXCu42ZVpZmUspCUEK0lKxnUuKJFVRCuNYUMJKNScIEzKjnWOJuju3HuwdnvAXxQfes1dF1pwA5eESkZIZxyHtHFiDZlB6o1tQ2u1HFV0Lc6frtuY3_JCpELSkUeA_dngcgE-AlNOXivNru3c5aMrHbWewe1Ori2L91REaxO1tVoXUXr6mRdyZihY8ZH1jTg1N4OzkRd_4R-Ad5Og-c |
CitedBy_id | crossref_primary_10_1007_s10891_023_02840_8 crossref_primary_10_1109_TCPMT_2023_3289053 crossref_primary_10_1016_j_tsep_2019_03_018 crossref_primary_10_1016_j_tsep_2018_09_012 crossref_primary_10_15222_TKEA2017_1_2_47 crossref_primary_10_1007_s00231_020_02972_0 crossref_primary_10_1007_s10891_021_02435_1 crossref_primary_10_15407_spqeo23_01_091 crossref_primary_10_1016_j_tsep_2020_100549 |
Cites_doi | 10.1117/12.808658 |
ContentType | Journal Article |
Copyright | Springer Science+Business Media New York 2017 COPYRIGHT 2017 Springer |
Copyright_xml | – notice: Springer Science+Business Media New York 2017 – notice: COPYRIGHT 2017 Springer |
DBID | AAYXX CITATION ISR 7TB 7U5 8FD FR3 KR7 L7M |
DOI | 10.1007/s10891-017-1543-8 |
DatabaseName | CrossRef Gale in Context: Science Mechanical & Transportation Engineering Abstracts Solid State and Superconductivity Abstracts Technology Research Database Engineering Research Database Civil Engineering Abstracts Advanced Technologies Database with Aerospace |
DatabaseTitle | CrossRef Civil Engineering Abstracts Solid State and Superconductivity Abstracts Engineering Research Database Technology Research Database Mechanical & Transportation Engineering Abstracts Advanced Technologies Database with Aerospace |
DatabaseTitleList | Civil Engineering Abstracts |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Engineering Physics |
EISSN | 1573-871X |
EndPage | 101 |
ExternalDocumentID | A497672276 10_1007_s10891_017_1543_8 |
GroupedDBID | -5B -5G -BR -EM -Y2 -~C -~X .86 .VR 06D 0R~ 0VY 1N0 1SB 2.D 28- 29K 29~ 2J2 2JN 2JY 2KG 2KM 2LR 2P1 2VQ 2~H 30V 4.4 406 408 409 40D 40E 5GY 5QI 5VS 642 67Z 6NX 8TC 8UJ 95- 95. 95~ 96X AAAVM AABHQ AABYN AAFGU AAHNG AAIAL AAJKR AANZL AARHV AARTL AATNV AATVU AAUYE AAWCG AAYFA AAYIU AAYQN AAYTO ABBBX ABBXA ABDBF ABDZT ABECU ABFGW ABFTD ABFTV ABHLI ABHQN ABJNI ABJOX ABKAG ABKAS ABKCH ABKTR ABMNI ABMQK ABNWP ABPTK ABQBU ABSXP ABTEG ABTHY ABTKH ABTMW ABULA ABWNU ABXPI ACBMV ACBRV ACBXY ACBYP ACGFS ACHSB ACHXU ACIGE ACIPQ ACIWK ACKNC ACMDZ ACMLO ACOKC ACOMO ACSNA ACTTH ACVWB ACWMK ADHHG ADHIR ADINQ ADKNI ADKPE ADMDM ADMVV ADOXG ADRFC ADTPH ADURQ ADYFF ADZKW AEBTG AEEQQ AEFIE AEFTE AEGAL AEGNC AEJHL AEJRE AEKMD AEKVL AEOHA AEPYU AESKC AESTI AETLH AEVLU AEVTX AEXYK AFEXP AFFNX AFGCZ AFLOW AFNRJ AFQWF AFWTZ AFZKB AGAYW AGDGC AGGBP AGGDS AGJBK AGMZJ AGQMX AGWIL AGWZB AGYKE AHAVH AHBYD AHKAY AHSBF AHYZX AIAKS AIIXL AILAN AIMYW AITGF AJBLW AJDOV AJRNO AKQUC ALMA_UNASSIGNED_HOLDINGS ALWAN AMKLP AMXSW AMYLF AMYQR AOCGG ARCEE ARMRJ AXYYD AZFZN B-. B0M BA0 BBWZM BDATZ BGNMA CAG COF CS3 CSCUP D-I DDRTE DL5 DNIVK DPUIP DU5 EAD EAP EBD EBLON EBS EIOEI EJD EMK ESBYG ESX FEDTE FERAY FFXSO FIGPU FINBP FNLPD FRRFC FSGXE FWDCC GGCAI GGRSB GJIRD GNWQR GQ6 GQ7 GQ8 GXS HF~ HG6 HMJXF HQYDN HRMNR HVGLF HZ~ I-F IAO IGS IHE IJ- IKXTQ ISR ITC IWAJR IXC IXD IXE IZIGR IZQ I~X I~Z J-C JBSCW JCJTX JZLTJ KDC KOV KOW LAK LLZTM M4Y MA- MK~ N2Q NB0 NDZJH NPVJJ NQJWS NU0 O9- O93 O9G O9I O9J OAM OVD P19 P9P PF0 PT4 PT5 QOK QOS R89 R9I RHV RNI RNS ROL RPX RSV RZC RZE RZK S16 S1Z S26 S27 S28 S3B SAP SCLPG SCV SDH SDM SEG SHX SISQX SJYHP SNE SNPRN SNX SOHCF SOJ SPISZ SRMVM SSLCW STPWE SZN T13 T16 TEORI TSG TSK TSV TUC TUS U2A UG4 UNUBA UOJIU UTJUX UZXMN VC2 VFIZW W23 W48 WK8 XU3 YLTOR Z5O Z7R Z7S Z7V Z7W Z7X Z7Y Z7Z Z83 Z86 Z88 Z8M Z8N Z8P Z8Q Z8R Z8S Z8T Z8W Z92 ZMTXR _50 ~8M ~A9 ~EX AACDK AAEOY AAJBT AASML AAYXX ABAKF ACAOD ACDTI ACZOJ AEFQL AEMSY AFBBN AGQEE AGRTI AIGIU CITATION H13 7TB 7U5 8FD FR3 KR7 L7M |
ID | FETCH-LOGICAL-c394t-d5befe6e55ce554ddc488898211cc84a4ef0d29d915cc2e3e8428757032850c03 |
IEDL.DBID | AGYKE |
ISSN | 1062-0125 |
IngestDate | Fri Aug 16 06:59:00 EDT 2024 Fri Feb 02 04:19:25 EST 2024 Thu Aug 01 20:26:53 EDT 2024 Thu Sep 12 22:31:01 EDT 2024 Sat Dec 16 12:08:25 EST 2023 |
IsPeerReviewed | true |
IsScholarly | true |
Issue | 1 |
Keywords | electronic components cooling condenser heat pipe evaporator |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-LOGICAL-c394t-d5befe6e55ce554ddc488898211cc84a4ef0d29d915cc2e3e8428757032850c03 |
Notes | ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 23 |
PQID | 1884115255 |
PQPubID | 23500 |
PageCount | 7 |
ParticipantIDs | proquest_miscellaneous_1884115255 gale_infotracacademiconefile_A497672276 gale_incontextgauss_ISR_A497672276 crossref_primary_10_1007_s10891_017_1543_8 springer_journals_10_1007_s10891_017_1543_8 |
PublicationCentury | 2000 |
PublicationDate | 1-2017 2017-1-00 20170101 |
PublicationDateYYYYMMDD | 2017-01-01 |
PublicationDate_xml | – year: 2017 text: 1-2017 |
PublicationDecade | 2010 |
PublicationPlace | New York |
PublicationPlace_xml | – name: New York |
PublicationTitle | Journal of engineering physics and thermophysics |
PublicationTitleAbbrev | J Eng Phys Thermophy |
PublicationYear | 2017 |
Publisher | Springer US Springer |
Publisher_xml | – name: Springer US – name: Springer |
References | E. Yakhshi-Tafti and H. Pearlman, Subcooled and saturated refrigerants in minichannel heat sinks, Proc. ASME 2014 4th Joint US-European Fluids Engineering Division Summer Meeting and 12th Int. Conf. on Nanochannels, Microchannels, and Minichannels, August 3–7, 2014, Chicago, Illinois, USA (2014), pp. 139–148. M. Tanski, M. Kocik, R. Barbucha, K. Garasz, J. Mizeraczyk, J. Kraśniewski, M. Oleksy, A. Hapka, and W. A. Janke, System for cooling electronic elements with an EHD coolant, Proc. FlowMicroTherm′2013 Conf. on Microtechnology and Thermal Problems in Electronics, Conf. Series 494 (2014) 012010. AnatychukLVichorLRozverYRassamakinBKhairnasovSNikolaenkoYResearch and development on performances of large-sized thermoelectric module with heat pipesInt. J. Heat Pipe Sci. Technol.201421111 DunnPDReayDAHeat Pipes1994OxfordPergamon Press A. A. Zhukauskas, Convective Transfer in Heat Exchangers [in Russian], Nauka, Moscow (1982). A. G. Kulakov, Intensification of Heat and Mass Exchange in the Evaporation-Condensation Elements of Two-Phase Systems for Provision of Thermal Regime, Candidate′s Dissertation (in Engineering), Minsk (2005). J. Vetrovec, Quasi-passive heat sink for high-power laser diodes, Proc. SPIE LASER 2009 Conf., San Jose, CA, Paper 7198-12 (2009). M. A. Mikheev and M. M. Mikheeva, Fundamentals of Heat Transfer [in Russian], Énergiya, Moscow (1973). I. V. Glukhikh, S. S. Polikarpov, S. V. Frolov, A. S. Volkov, and V. V. Privezentsev, Cooling of laser diode assemblies of the silver-bullet type, Zh. Tekh. Fiz., 80, Issue 7, 101–105 (2010). 1543_CR3 1543_CR4 L Anatychuk (1543_CR5) 2014; 2 1543_CR9 1543_CR7 1543_CR8 1543_CR1 1543_CR2 PD Dunn (1543_CR6) 1994 |
References_xml | – ident: 1543_CR2 – ident: 1543_CR3 – ident: 1543_CR4 – ident: 1543_CR9 – ident: 1543_CR7 – ident: 1543_CR8 – volume-title: Heat Pipes year: 1994 ident: 1543_CR6 contributor: fullname: PD Dunn – ident: 1543_CR1 doi: 10.1117/12.808658 – volume: 2 start-page: 1 issue: 1 year: 2014 ident: 1543_CR5 publication-title: Int. J. Heat Pipe Sci. Technol. contributor: fullname: L Anatychuk |
SSID | ssj0009843 |
Score | 2.1470523 |
Snippet | Results of computational and experimental investigations of heat pipes having a predetermined thermal resistance and a system based on these pipes for air... |
SourceID | proquest gale crossref springer |
SourceType | Aggregation Database Publisher |
StartPage | 95 |
SubjectTerms | Classical Mechanics Complex Systems Cooling systems Copper (Metal) Copper products Diodes Electronic components Electronic components industry Electronic devices Engineering Engineering Thermodynamics Evaporation Heat and Mass Transfer Heat pipes Heat transfer Heat transmission Industrial Chemistry/Chemical Engineering Thermodynamics |
Title | System for Cooling of Electronic Components |
URI | https://link.springer.com/article/10.1007/s10891-017-1543-8 https://search.proquest.com/docview/1884115255 |
Volume | 90 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwlV1LS-RAEC50ZGE9-NoVxxdRFgSXDDOd7qRzHGR8ooddB_TU9CtzEBIxmYu_3qpM4tuDh0AOTadT1fXorqqvAP4YEbnIIwe0SFnIM4dvMQqeSZzp68SlRlLt8OVVfDrm5zfiZg7Y89VFftdrI5K1on5V6yYpSQeVKlr9KJTzsCAI76sDC8OT24vRC9SubNLqY0o6YKKNZX42yRtr9F4nfwiO1jbneHlWB1jWUIWUanLXm1amZx8_Ajl-43dWYKlxQYPhbM-swpzP12DxFTDhGvyoE0Nt-QsaSPMAfdvgqKAOP5OgyILRc_ecgDRKkVM-xm8YH4-uj07DpsFCaKOUV6ETxmc-9kJYfLhzFsVZphIPhdZKrrnP-o6lLh0Ia5lHntIBizC7mBR924_WoZPjFzYg0M44r9F_0QPHjXcE646-EfOJ9gn6EF04bAmt7mc4GuoFMZlooZAWimihZBf2iRWK8ClySoCZ6GlZqrP__9SQo_-E8yZxFw6aQVlRPWirm3oCXA9BWr0ZudeyVKHwUERE576YlmogJR9QByjRhb8tn1QjxeXXC9z81ugt-MmI0fXFzTZ0qoep30FXpjK7zd7dhfkxGz4BjSToVQ |
link.rule.ids | 315,786,790,27955,27956,41114,41556,42183,42625,52144,52267 |
linkProvider | Springer Nature |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwlV1LT-MwEB5B0Qo4wMKCKM-AVkJaFNQmduIcK1Qoy-OwFAlOll_hgJQgkl749cy0Dq-FA4dIOViO4_E8kvnmG4Dfmsc2digBxbMoZLnFuwQVT6dWd1RqMy2odvjiMhlcs783_MbXcVcN2r1JSY4t9ZtiN0EoHbSq6PbjUEzDDCMH34KZ3sntWf-Va1d4XH1CqIOIN8nMzyZ5544-GuX_sqNjp3O8CMNmuROsyf3hqNaH5ukDk-M33-cnLPggNOhNTs0STLliGebfUBMuw48xNNRUv8CTmgcY3QZHJfX4uQvKPOi_9M8JyKaUBSEyVuD6uD88GoS-xUJo4ozVoeXa5S5xnBu8mLUGFVpkAj8LjRFMMZd3bJTZrMuNiRxKlT6xiLUrErxjOvEqtAp8whoEymrrFEYwqmuZdpaI3TE6ilyqXIpRRBv-NDstHyZMGvKVM5n2QuJeSNoLKdqwR7KQxFBREATmTo2qSp5e_ZM9hhEUzpsmbdj3g_KyflRG-YoCXA-RWr0budvIVKL6UE5EFa4cVbIrBOtSDyjehoNGTtLrcfX1Ate_NXoHZgfDi3N5fnp5tgFzEQl9_BtnE1r148htYWBT621_kJ8B0ErrQA |
linkToPdf | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwlV1LT8MwDLZgCAQHxFOMZ0FISKBqW5u06XEam3hOCJi0W5QmKbcWrd3_x95a2HgcOFTqIUoj24m_1PZngPOY-8a3qAHFI89licG3ADdeHJq4qUITxYJqhx_7wc2A3Q35sOxzmlfZ7lVIclrTQCxNadF4N0ljpvBNUMYOnrAIAXxXLMISeUYy8YHX_mLdFWWGfUD5Bx6vwpq_TTHnmL4fzz_ipBP309uA9RI3Ou2pojdhwaZbsDbDJrgFy5NsTp1vQ8lD7iAgdToZteV5c7LE6X62vHHoGMhSSqLYgUGv-9q5ccuuCK72I1a4hsc2sYHlXOPDjNG4B0Uk8CantWCK2aRpvMhELa61Z1ERdCsioi1P8KZu-rtQS_ELe-AoExurEHSolmGxNcTFjoDGs6GyITr-OlxWIpHvU_IL-UVzTPKTKD9J8pOiDmckNEmkEillrbypcZ7L25dn2WYIenDeMKjDRTkoyYqR0qosAsD1EA_V3MjTSvgSLZ7CGCq12TiXLSFYi9o28TpcVVqR5dbL_17g_r9Gn8DK03VPPtz27w9g1SM7mfx4OYRaMRrbI4QiRXw8MbcPmLnSvg |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=System+for+cooling+of+electronic+components&rft.jtitle=Journal+of+engineering+physics+and+thermophysics&rft.au=Vasilev%2C+L.L.%2C+Jr&rft.au=Grakovich%2C+L.P&rft.au=Dragun%2C+L.A&rft.au=Zhuravlev%2C+A.S&rft.date=2017-01-01&rft.pub=Springer&rft.issn=1062-0125&rft.eissn=1573-871X&rft.volume=90&rft.issue=1&rft.spage=95&rft_id=info:doi/10.1007%2Fs10891-017-1543-8&rft.externalDBID=ISR&rft.externalDocID=A497672276 |
thumbnail_l | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=1062-0125&client=summon |
thumbnail_m | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=1062-0125&client=summon |
thumbnail_s | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=1062-0125&client=summon |