System for Cooling of Electronic Components
Results of computational and experimental investigations of heat pipes having a predetermined thermal resistance and a system based on these pipes for air cooling of electronic components and diode assemblies of lasers are presented. An efficient compact cooling system comprising heat pipes with an...
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| Published in | Journal of engineering physics and thermophysics Vol. 90; no. 1; pp. 95 - 101 |
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| Main Authors | , , , , , |
| Format | Journal Article |
| Language | English |
| Published |
New York
Springer US
2017
Springer |
| Subjects | |
| Online Access | Get full text |
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| Abstract | Results of computational and experimental investigations of heat pipes having a predetermined thermal resistance and a system based on these pipes for air cooling of electronic components and diode assemblies of lasers are presented. An efficient compact cooling system comprising heat pipes with an evaporator having a capillary coating of a caked copper powder and a condenser having a developed outer finning, has been deviced. This system makes it possible to remove, to the ambient air, a heat flow of power more than 300 W at a temperature of 40–50°C. |
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| AbstractList | Results of computational and experimental investigations of heat pipes having a predetermined thermal resistance and a system based on these pipes for air cooling of electronic components and diode assemblies of lasers are presented. An efficient compact cooling system comprising heat pipes with an evaporator having a capillary coating of a caked copper powder and a condenser having a developed outer finning, has been deviced. This system makes it possible to remove, to the ambient air, a heat flow of power more than 300 W at a temperature of40-50[degrees]C. Keywords: heat pipe, evaporator, condenser, cooling, electronic components. Results of computational and experimental investigations of heat pipes having a predetermined thermal resistance and a system based on these pipes for air cooling of electronic components and diode assemblies of lasers are presented. An efficient compact cooling system comprising heat pipes with an evaporator having a capillary coating of a caked copper powder and a condenser having a developed outer finning, has been deviced. This system makes it possible to remove, to the ambient air, a heat flow of power more than 300 W at a temperature of 40-50 degree C. Results of computational and experimental investigations of heat pipes having a predetermined thermal resistance and a system based on these pipes for air cooling of electronic components and diode assemblies of lasers are presented. An efficient compact cooling system comprising heat pipes with an evaporator having a capillary coating of a caked copper powder and a condenser having a developed outer finning, has been deviced. This system makes it possible to remove, to the ambient air, a heat flow of power more than 300 W at a temperature of 40–50°C. |
| Audience | Academic |
| Author | Rabetskii, M. I. Vasil’ev, L. L. Olekhnovich, V. A. Grakovich, L. P. Zhuravlev, A. S. Dragun, L. A. |
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| References | E. Yakhshi-Tafti and H. Pearlman, Subcooled and saturated refrigerants in minichannel heat sinks, Proc. ASME 2014 4th Joint US-European Fluids Engineering Division Summer Meeting and 12th Int. Conf. on Nanochannels, Microchannels, and Minichannels, August 3–7, 2014, Chicago, Illinois, USA (2014), pp. 139–148. M. Tanski, M. Kocik, R. Barbucha, K. Garasz, J. Mizeraczyk, J. Kraśniewski, M. Oleksy, A. Hapka, and W. A. Janke, System for cooling electronic elements with an EHD coolant, Proc. FlowMicroTherm′2013 Conf. on Microtechnology and Thermal Problems in Electronics, Conf. Series 494 (2014) 012010. AnatychukLVichorLRozverYRassamakinBKhairnasovSNikolaenkoYResearch and development on performances of large-sized thermoelectric module with heat pipesInt. J. Heat Pipe Sci. Technol.201421111 DunnPDReayDAHeat Pipes1994OxfordPergamon Press A. A. Zhukauskas, Convective Transfer in Heat Exchangers [in Russian], Nauka, Moscow (1982). A. G. Kulakov, Intensification of Heat and Mass Exchange in the Evaporation-Condensation Elements of Two-Phase Systems for Provision of Thermal Regime, Candidate′s Dissertation (in Engineering), Minsk (2005). J. Vetrovec, Quasi-passive heat sink for high-power laser diodes, Proc. SPIE LASER 2009 Conf., San Jose, CA, Paper 7198-12 (2009). M. A. Mikheev and M. M. Mikheeva, Fundamentals of Heat Transfer [in Russian], Énergiya, Moscow (1973). I. V. Glukhikh, S. S. Polikarpov, S. V. Frolov, A. S. Volkov, and V. V. Privezentsev, Cooling of laser diode assemblies of the silver-bullet type, Zh. Tekh. Fiz., 80, Issue 7, 101–105 (2010). 1543_CR3 1543_CR4 L Anatychuk (1543_CR5) 2014; 2 1543_CR9 1543_CR7 1543_CR8 1543_CR1 1543_CR2 PD Dunn (1543_CR6) 1994 |
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| SubjectTerms | Classical Mechanics Complex Systems Cooling systems Copper (Metal) Copper products Diodes Electronic components Electronic components industry Electronic devices Engineering Engineering Thermodynamics Evaporation Heat and Mass Transfer Heat pipes Heat transfer Heat transmission Industrial Chemistry/Chemical Engineering Thermodynamics |
| Title | System for Cooling of Electronic Components |
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