System for Cooling of Electronic Components

Results of computational and experimental investigations of heat pipes having a predetermined thermal resistance and a system based on these pipes for air cooling of electronic components and diode assemblies of lasers are presented. An efficient compact cooling system comprising heat pipes with an...

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Bibliographic Details
Published inJournal of engineering physics and thermophysics Vol. 90; no. 1; pp. 95 - 101
Main Authors Vasil’ev, L. L., Grakovich, L. P., Dragun, L. A., Zhuravlev, A. S., Olekhnovich, V. A., Rabetskii, M. I.
Format Journal Article
LanguageEnglish
Published New York Springer US 2017
Springer
Subjects
Classical Mechanics
Complex Systems
Cooling systems
Copper (Metal)
Copper products
Diodes
Electronic components
Electronic components industry
Electronic devices
Engineering
Engineering Thermodynamics
Evaporation
Heat and Mass Transfer
Heat pipes
Heat transfer
Heat transmission
Industrial Chemistry/Chemical Engineering
Thermodynamics
electronic components
cooling
condenser
heat pipe
evaporator
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Summary:Results of computational and experimental investigations of heat pipes having a predetermined thermal resistance and a system based on these pipes for air cooling of electronic components and diode assemblies of lasers are presented. An efficient compact cooling system comprising heat pipes with an evaporator having a capillary coating of a caked copper powder and a condenser having a developed outer finning, has been deviced. This system makes it possible to remove, to the ambient air, a heat flow of power more than 300 W at a temperature of 40–50°C.
Bibliography:ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 23
ISSN:1062-0125
1573-871X
DOI:10.1007/s10891-017-1543-8