Conductivity mechanisms of isotropic conductive adhesives (ICAs)

• Published in: IEEE transactions on electronics packaging manufacturing Vol. 22; no. 3; pp. 223 - 227
• Main Authors: Daoqiang Lu, Tong, Q.K., Wong, C.P.
• Format: Journal Article
• Language: English
• Published: IEEE 01.07.1999
• Subjects: Adhesives; Chemicals; Conductive adhesives; Cures; Flakes; Independent component analysis; Lead; Lubricants; Materials science and technology; Polymers; Resins; Resistivity; Shrinkage; Silver; Testing; Thermal conductivity
• ISSN: 1521-334X; 1558-0822
• DOI: 10.1109/6104.795857

Isotropic conductive adhesives (ICAs) are usually composites of adhesive resins with conductive fillers (mainly silver flakes). The adhesive pastes before cure usually have low electrical conductivity. The conductive adhesives become highly conductive only after the adhesives are cured and solidified. The mechanisms of conductivity achievement in conductive adhesives were discussed. Experiments were carefully designed in order to determine the roles of adhesive shrinkage and silver (Ag) flake lubricant removal on adhesive conductivity achievement during cure. The conductivity establishment of the selected adhesive pastes and the cure shrinkage of the corresponding adhesive resins during cure were studied. Then conductivity developments of some metallic fillers and ICA pastes with external pressures were studied by using a specially designed test device. In addition, conductivity, resin cure shrinkage, and Ag flake lubricant behavior of an ICA which was cured at room temperature (25/spl deg/C) were investigated. Based on the results, it was found that cure shrinkage of the resin, rather than lubricant removal, was the prerequisite for conductivity development of conductive adhesives. In addition, an explanation of how cure shrinkage could cause conductivity achievement of conductive adhesives during cure was proposed in this paper.