Hydrogenation of nanocrystalline Si thin film transistors employing inductively coupled plasma chemical vapor deposition for flexible electronics

We have investigated the plasma hydrogenation effect on a nanocrystalline silicon (nc-Si) thin film transistor (TFT) fabricated by inductively coupled plasma chemical vapor deposition (ICP-CVD) at 150 °C. The top-gate nc-Si TFT showed a mobility of ∼ 6 cm 2/Vs and V th of 8 V. The hydrogenation empl...

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Bibliographic Details
Published inThin solid films Vol. 515; no. 19; pp. 7442 - 7445
Main Authors Han, Sang-Myeon, Park, Joong-Hyun, Park, Sang-Geun, Kim, Sun-Jae, Han, Min-Koo
Format Journal Article Conference Proceeding
LanguageEnglish
Published Lausanne Elsevier B.V 16.07.2007
Elsevier Science
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Summary:We have investigated the plasma hydrogenation effect on a nanocrystalline silicon (nc-Si) thin film transistor (TFT) fabricated by inductively coupled plasma chemical vapor deposition (ICP-CVD) at 150 °C. The top-gate nc-Si TFT showed a mobility of ∼ 6 cm 2/Vs and V th of 8 V. The hydrogenation employing ICP-CVD was performed at 100 °C for 4 min in order to improve the characteristics of nc-Si TFT. The mobility was increased from ∼ 6 cm 2/Vs to 11 cm 2/Vs. The V th of the nc-Si TFTs was decreased to about 6.8 V from 8.1 V. The on-current at the saturation regime also increased by 66% while the off current was increased slightly. The improvement of mobility, threshold voltage and on-current can be attributed to the hydrogen passivation of the Si dangling bonds in the nc-Si film. The experimental results showed that the 100 °C ICP-CVD hydrogenation is effective to improve the 150 °C nc-Si TFT.
ISSN:0040-6090
1879-2731
DOI:10.1016/j.tsf.2006.11.147