Hydrogenation of nanocrystalline Si thin film transistors employing inductively coupled plasma chemical vapor deposition for flexible electronics
We have investigated the plasma hydrogenation effect on a nanocrystalline silicon (nc-Si) thin film transistor (TFT) fabricated by inductively coupled plasma chemical vapor deposition (ICP-CVD) at 150 °C. The top-gate nc-Si TFT showed a mobility of ∼ 6 cm 2/Vs and V th of 8 V. The hydrogenation empl...
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Published in | Thin solid films Vol. 515; no. 19; pp. 7442 - 7445 |
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Main Authors | , , , , |
Format | Journal Article Conference Proceeding |
Language | English |
Published |
Lausanne
Elsevier B.V
16.07.2007
Elsevier Science |
Subjects | |
Online Access | Get full text |
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Summary: | We have investigated the plasma hydrogenation effect on a nanocrystalline silicon (nc-Si) thin film transistor (TFT) fabricated by inductively coupled plasma chemical vapor deposition (ICP-CVD) at 150 °C. The top-gate nc-Si TFT showed a mobility of ∼
6 cm
2/Vs and
V
th of 8 V. The hydrogenation employing ICP-CVD was performed at 100 °C for 4 min in order to improve the characteristics of nc-Si TFT. The mobility was increased from ∼
6 cm
2/Vs to 11 cm
2/Vs. The
V
th of the nc-Si TFTs was decreased to about 6.8 V from 8.1 V. The on-current at the saturation regime also increased by 66% while the off current was increased slightly. The improvement of mobility, threshold voltage and on-current can be attributed to the hydrogen passivation of the Si dangling bonds in the nc-Si film. The experimental results showed that the 100 °C ICP-CVD hydrogenation is effective to improve the 150 °C nc-Si TFT. |
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ISSN: | 0040-6090 1879-2731 |
DOI: | 10.1016/j.tsf.2006.11.147 |