Molecular dynamics simulation on rapid boiling of water on a hot copper plate

• Published in: Applied thermal engineering Vol. 62; no. 2; pp. 607 - 612
• Main Authors: Mao, Yijin, Zhang, Yuwen
• Format: Journal Article
• Language: English
• Published: Kidlington Elsevier Ltd 2014; Elsevier
• Subjects: Applied sciences; Boiling; COMPUTER SIMULATION; Copper; Density; Energy; Energy. Thermal use of fuels; Exact sciences and technology; Heat transfer; Liquids; Molecular dynamics; PLATE; Rapid phase transition; Theoretical studies. Data and constants. Metering; Walls; Water; Molecular dynamics; Boiling; Rapid phase transition; Water; Simulation; Copper
• ISSN: 1359-4311
• DOI: 10.1016/j.applthermaleng.2013.10.032

Molecular dynamics simulation is carried out to study the rapid boiling of liquid water film heated by a hot copper plate in a confined space. A more physically-sound thermostat is applied to control the temperature of the metal plate and then to heat water molecules that are placed in the elastic wall confined simulation domain. The results show that liquid water molecules close to the plate are instantly overheated and undergo a rapid phase transition. A non-vaporization molecular layer, with a constant density of 0.2 g/cm3, tightly attached to the surface of the plate is observed. Temperatures at three corresponding regions, which are vapor, liquid, and vapor from the top plate surface, are also computed and analyzed along with the piston-like motion of the bulk liquid film. •Molecular dynamics simulation is carried out to study the rapid boiling of liquid water film.•A more physically-sound thermostat is applied to control the temperature of the metal plate.•The liquid water molecules near the plate are instantly overheated and undergo a rapid boiling.•A non-vaporization molecular layer tightly attached to the surface of the plate is observed.•The piston-like motion of the bulk liquid film are computed and analyzed.