Development of conformal phosphor coating technique for light-emitting diodes using image-processing-based maskless lithography

•A conformal, chip-level phosphor coating technique using IP-ML was developed.•Conformal phosphor coating was performed on an LED array on a blue tape.•IP-ML make a chip-level conformal phosphor coating with contact openings.•The fabricated white LEDs provided a uniform color distribution.•Color bin...

Full description

Saved in:
Bibliographic Details
Published inMicroelectronic engineering Vol. 118; pp. 11 - 14
Main Authors Jang, Jisung, Han, Sangkwon, Chung, Su Eun, Choi, Yong Joon, Kwon, Sunghoon
Format Journal Article
LanguageEnglish
Published Amsterdam Elsevier B.V 25.04.2014
Elsevier
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:•A conformal, chip-level phosphor coating technique using IP-ML was developed.•Conformal phosphor coating was performed on an LED array on a blue tape.•IP-ML make a chip-level conformal phosphor coating with contact openings.•The fabricated white LEDs provided a uniform color distribution.•Color binning can be carried out prior to the packaging process. We introduce a conformal phosphor coating technique for white light-emitting diodes (LEDs) using image-processing-based maskless lithography (IP-ML). The use of IP-ML allows real-time recognition of LEDs, which enables the generation of photo-patterning masks on a spatial light modulator by means of image processing, making the process suitable for a chip-level conformal phosphor coating with contact openings. This automated photolithographic chip array coating process enables phosphor coating onto chips with a consistent thickness, and the chips treated using this method show a narrow color distribution in which the chromaticity is controllable by varying phosphor thickness and concentration.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ObjectType-Article-1
ObjectType-Feature-2
ISSN:0167-9317
1873-5568
DOI:10.1016/j.mee.2014.01.006