Analyzing resistance response of embedded PDMS and carbon nanotubes composite under tensile strain
•Polymer nanocomposite for large strain measurements have been demonstrated.•Stress relaxation behaviors in nanocomposite under large strain have been studied.•Temporal logarithmic decay has been analyzed in relevance to stress relaxation. We report the electrical resistive response of an elastomeri...
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Published in | Microelectronic engineering Vol. 117; pp. 1 - 7 |
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Main Authors | , |
Format | Journal Article |
Language | English |
Published |
Amsterdam
Elsevier B.V
01.04.2014
Elsevier |
Subjects | |
Online Access | Get full text |
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Summary: | •Polymer nanocomposite for large strain measurements have been demonstrated.•Stress relaxation behaviors in nanocomposite under large strain have been studied.•Temporal logarithmic decay has been analyzed in relevance to stress relaxation.
We report the electrical resistive response of an elastomeric composite material, composed of poly(dimethylsiloxane) (PDMS) and multi-walled carbon nanotubes (MWCNTs), to large mechanical deformations. A nanocomposite pattern was embedded in bulk PDMS to work as a strain sensor, and the device was fabricated with simplicity through microcontact printing and cast molding techniques. Testing of the device revealed a significant and consistent change in its resistance subject to large tensile strains (>45%). Some peculiar hysteresis effects of resistance response were observed during the course of characterization. To reveal underlying polymeric mechanisms, stress and resistance of bulk polymer nanocomposite samples were tested under various conditions. As a result, the resistance was found to be dependent on a number of factors such as stress, strain rate and strain history or time. Likewise, stress was also found to be possibly dependent on the same variables. |
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Bibliography: | ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 23 ObjectType-Article-1 ObjectType-Feature-2 |
ISSN: | 0167-9317 1873-5568 |
DOI: | 10.1016/j.mee.2013.11.013 |