Ag Nanoparticle Paste Synthesis for Room Temperature Bonding

Time-dependent sintering properties of an Ag nanoparticle paste for room temperature bonding were investigated. Ag nanoparticle paste with a small amount of dodecylamine dispersant can sinter at room temperature by the evaporation of toluene solvent. When the solvent evaporates, sintering with neck...

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Bibliographic Details
Published inIEEE transactions on components and packaging technologies Vol. 33; no. 2; pp. 437 - 442
Main Authors Wakuda, Daisuke, Keun-Soo Kim, Suganuma, Katsuaki
Format Journal Article
LanguageEnglish
Published New York IEEE 01.06.2010
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
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Summary:Time-dependent sintering properties of an Ag nanoparticle paste for room temperature bonding were investigated. Ag nanoparticle paste with a small amount of dodecylamine dispersant can sinter at room temperature by the evaporation of toluene solvent. When the solvent evaporates, sintering with neck growth and the coalescence of particles is initiated within half an hour and the Ag grain continues to grow gradually for hours. Furthermore, a time-dependent change in the shear strength is demonstrated using a bonding test with Cu plates at room temperature. Bonding between the Ag paste and a Cu plate is favorable and fracturing occurs within the sintered Ag body. The strength of sintered Ag increases with sintering time due to neck growth and the coalescence of particles. The shear strength is more than 8 MPa after 6 h and 12 h of drying.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:1521-3331
1557-9972
DOI:10.1109/TCAPT.2009.2031680