Bioinspired corrosion inhibition for printed circuit board: implications of dendritic Sn-ZIF-LIS coating on Cu metal

Printed circuit boards (PCB) are easily corroded under moist environment due to formation of dendrites and short circuit. It would be a promising approach to exploit intentionally formed dendrite covered by functional coating for corrosion inhibition to elongate the lifespan of PCB. In this work, a...

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Bibliographic Details
Published inJournal of materials science Vol. 58; no. 25; pp. 10539 - 10554
Main Authors Wei, Yinsha, Haider, Zeeshan, Yu, Yizhen, Li, Bingzhi, Niu, Haili, Qiu, Ri, Ouyang, Yibo, Liu, Jie
Format Journal Article
LanguageEnglish
Published New York Springer US 01.07.2023
Springer
Springer Nature B.V
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Summary:Printed circuit boards (PCB) are easily corroded under moist environment due to formation of dendrites and short circuit. It would be a promising approach to exploit intentionally formed dendrite covered by functional coating for corrosion inhibition to elongate the lifespan of PCB. In this work, a facile electrodeposition method has been applied to grow dendritic tin onto Cu as a substrate for PCB. Bioinspired formation of superhydrophobic surface (SHS) and liquid-infused surface (LIS) are adopted to minimize access of moisture to underneath Cu metal. In this regard, dimethylsilicone oil and zeolitic imidazolate framework (ZIF) nanoparticles are infused into dendritic matrix to form a solid–liquid ZIF-LIS coating. Morphology, composition and wettability are characterized by different sophisticated techniques. Beyond significant improvement in corrosion resistance, ZIF-LIS has demonstrated self-healing properties, improved mechanical stability and anti-icing behavior. Current finding provides a new approach to fabricate coating for PCB having extended stability against corrosive degradation. Graphical abstract
ISSN:0022-2461
1573-4803
DOI:10.1007/s10853-023-08673-3