Microheater with copper nanofiber network via electrospinning and electroless deposition

• Published in: Scientific reports Vol. 13; no. 1; p. 22248
• Main Authors: Kim, Na Kyoung, Kim, Kanghyun, Jang, Hansol, An, Taechang, Shin, Hyun-Joon, Kim, Geon Hwee
• Format: Journal Article
• Language: English
• Published: England Nature Publishing Group 14.12.2023; Nature Portfolio
• Subjects: Cell culture; Copper; Etching; Heat; Heat treatment; Heat treatments; Microelectromechanical systems; Microscopes; Palladium; Polyvinylpyrrolidone; Temperature distribution
• ISSN: 2045-2322; 2045-2322
• DOI: 10.1038/s41598-023-49741-7

In this report, we present the development of a copper nanofiber network-based microheater, designed for applications in electron microscopes, gas sensing, and cell culture platforms. The seed layer, essential for electroless deposition, was fabricated through the electrospinning of a palladium-contained polyvinylpyrrolidone solution followed by a heat treatment. This process minimized the contact resistance between nanofibers. We successfully fabricated a microheater with evenly distributed temperature by controlling the electrospinning time, heat treatment conditions, and electroless deposition time. We assessed the electrical and thermal characteristics of the microheater by examining the nanofiber density, sheet resistance, and transmittance. The microheater's performance was evaluated by applying current, and we verified its capacity to heat up to a maximum of 350 °C. We further observed the microheater's temperature distribution at varying current levels through an infrared camera. The entire manufacturing procedure takes place under normal pressure, eliminating the need for masking or etching processes. This renders the method easily adaptable to the mass production of microdevices. The method is expected to be applicable to various materials and sizes and is cost-effective compared to commercially produced microheaters developed through microelectromechanical system processes, which demand complex facilities and high cost.