Enclosed SU-8 and PDMS microchannels with integrated interconnects for chip-to-chip and world-to-chip connections

• Published in: Journal of micromechanics and microengineering Vol. 18; no. 6; pp. 064014 - 064014 (9)
• Main Authors: Westwood, S M, Jaffer, S, Gray, B L
• Format: Journal Article Conference Proceeding
• Language: English
• Published: Bristol IOP Publishing 01.06.2008; Institute of Physics
• Subjects: Applied fluid mechanics; Applied sciences; Exact sciences and technology; Fluid dynamics; Fluidics; Fundamental areas of phenomenology (including applications); Mechanical engineering. Machine design; Physics; Precision engineering, watch making; Dimethylsiloxane polymer; Pressure drop; Photopolymerization; Epoxy resin; Photoresists; Plastic packaging; Experimental study; Photolithography; Leaks; Microfluidics; Fluidics
• ISSN: 0960-1317; 1361-6439
• DOI: 10.1088/0960-1317/18/6/064014

This paper presents the simulation, fabrication and testing of fluid-tight enclosed microchannels with integrated interconnects for modular snap-together chip-to-chip and world-to-chip connections. Components consisting of microchannels with integrated interconnect were fabricated in SU-8 photopolymer and polydimethylsiloxane (PDMS). Simulations were performed in ANSYS for component microchannels with chip-to-chip and world-to-chip interconnects in order to determine the expected flow profile and pressure drop. Components with world-to-chip structures were then experimentally pressurized to 252 kPa and 148 kPa for SU-8 and PDMS respectively, without leakage. Components with chip-to-chip interconnects were assembled in a hybrid configuration utilizing SU-8 and PDMS for individual components assembled in a chain, and pressurized to 124 kPa before leakage. The duality of these structures as both world-to-chip and chip-to-chip connections increases their usability since they can provide micro- to macro-connections, as well as chip-to-chip connections without needing to redesign the interconnection scheme.